EP 1137708 A1 20011004 - EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Title (en)
EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
Title (de)
EPOXIDHARZZUSAMMENSETZUNG UND HALBLEITERANORDNUNG
Title (fr)
COMPOSITION A BASE DE RESINE EPOXY ET DISPOSITIF SEMI-CONDUCTEUR
Publication
Application
Priority
- JP 0005992 W 20000904
- JP 25160099 A 19990906
Abstract (en)
[origin: WO0118115A1] The present invention provides an epoxy resin composition for encapsulating of semiconductors which is suitable for area mounting type semiconductor devices and is less in warping and excellent in soldering crack resistance. The epoxy resin composition comprises (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator and (D) an inorganic filler as main components, where properties of a cured product formed by heating and curing the epoxy resin composition satisfy expressions, a>/=10<R> (R=10x(b+c)-1), 300</=a</=20000 and 0.15</=b+c</=0.50 in which a denotes a flexural modulus (N/mm<2>) at molding temperature, b denotes a cure shrinkage (%) and c denotes a heat shrinkage (%) of from molding temperature to room temperature.
IPC 1-7
IPC 8 full level
C08L 61/04 (2006.01); C08L 63/00 (2006.01); H01L 23/29 (2006.01)
CPC (source: EP KR)
C08L 61/04 (2013.01 - EP KR); C08L 63/00 (2013.01 - EP KR); H01L 23/293 (2013.01 - EP KR); C08L 2666/22 (2013.01 - KR); H01L 2924/0002 (2013.01 - EP KR); H01L 2924/12044 (2013.01 - EP KR)
Citation (search report)
See references of WO 0118115A1
Designated contracting state (EPC)
DE FR GB NL
DOCDB simple family (publication)
WO 0118115 A1 20010315; CN 1321179 A 20011107; EP 1137708 A1 20011004; KR 100663680 B1 20070102; KR 20010086441 A 20010912; TW I281482 B 20070521
DOCDB simple family (application)
JP 0005992 W 20000904; CN 00801800 A 20000904; EP 00956907 A 20000904; KR 20017005298 A 20010427; TW 89118170 A 20000905