Global Patent Index - EP 1137713 A1

EP 1137713 A1 20011004 - POLYAMIDE COMPOSITION FOR MOLDING

Title (en)

POLYAMIDE COMPOSITION FOR MOLDING

Title (de)

POLYAMIDFORMMASSEN

Title (fr)

COMPOSITION POLYAMIDE POUR MOULAGE

Publication

EP 1137713 A1 20011004 (EN)

Application

EP 99971014 A 19991022

Priority

  • JP 30283398 A 19981023
  • US 9924767 W 19991022

Abstract (en)

[origin: WO0024830A1] A polyamide composition for molded products having thin-wall parts and for connectors for use in automobiles, containing: A) 100 wt parts of a semi-aromatic polyamide having a melting point of 280 to 320 DEG C and a glass transition temperature of 95 to 115 DEG C, wherein the amount of aromatic monomer constituting the polyamide is at least 30 mol %, and B) 1 to 70 wt parts of an impact resistance agent composed mainly of a modified polyolefin that has been graft-modified by means of a carboxylic acid or a carboxylic anhydride.

IPC 1-7

C08L 77/06; H01B 3/30; H01R 13/46; C08L 77/00

IPC 8 full level

C08L 77/00 (2006.01); C08L 77/06 (2006.01); H01R 13/46 (2006.01)

CPC (source: EP KR)

C08L 51/006 (2013.01 - KR); C08L 77/00 (2013.01 - EP); C08L 77/06 (2013.01 - EP KR); H01R 13/46 (2013.01 - KR); C08L 2201/08 (2013.01 - KR); H01R 13/46 (2013.01 - EP)

Citation (search report)

See references of WO 0024830A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

WO 0024830 A1 20000504; WO 0024830 A9 20011206; AU 1449600 A 20000515; CA 2341992 A1 20000504; CN 1324386 A 20011128; EP 1137713 A1 20011004; JP 2000129122 A 20000509; KR 20010099715 A 20011109; TW 459421 B 20011011

DOCDB simple family (application)

US 9924767 W 19991022; AU 1449600 A 19991022; CA 2341992 A 19991022; CN 99812509 A 19991022; EP 99971014 A 19991022; JP 30283398 A 19981023; KR 20017005026 A 20010421; TW 88118313 A 19991119