EP 1142456 A1 20011010 - PROCESS FOR DEPOSITING CONDUCTING LAYER ON SUBSTRATE
Title (en)
PROCESS FOR DEPOSITING CONDUCTING LAYER ON SUBSTRATE
Title (de)
VERFAHREN ZUR BESCHICHTUNG VON SUBSTRATEN MIT LEITENDEN SCHICHTEN
Title (fr)
TECHNIQUE DE DEPOT DE COUCHE CONDUCTRICE SUR UN SUBSTRAT
Publication
Application
Priority
- GB 9904064 W 19991203
- GB 9826446 A 19981203
- GB 9826447 A 19981203
Abstract (en)
[origin: WO0033625A1] A process for forming a conductive layer on a substrate, comprising the steps of depositing ink on the substrate by means of lithographic printing to form a seeding layer, and depositing a first electrically conducting layer on the seeding layer by electroless deposition.
IPC 1-7
IPC 8 full level
C23C 18/20 (2006.01); C25D 7/00 (2006.01); H05K 3/12 (2006.01); H05K 3/18 (2006.01); H05K 3/24 (2006.01); H05K 3/32 (2006.01); H05K 1/09 (2006.01)
CPC (source: EP)
H05K 3/1275 (2013.01); H05K 3/246 (2013.01); H05K 1/095 (2013.01); H05K 3/182 (2013.01); H05K 2203/1173 (2013.01); Y02E 60/10 (2013.01)
Citation (third parties)
Third party :
- US 3226256 A 19651228 - SCHNEBLE JR FREDERICK W, et al
- GB 2000197 A 19790104 - PREH GMBH W
- EP 0322977 A2 19890705 - SHELL INT RESEARCH [NL]
- US 5158645 A 19921027 - COVERT KATHLEEN L [US], et al
- See also references of WO 0033625A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 0033625 A1 20000608; AU 1574600 A 20000619; AU 762686 B2 20030703; CA 2350506 A1 20000608; CN 1242659 C 20060215; CN 1335045 A 20020206; EP 1142456 A1 20011010; HK 1042627 A1 20020816; IL 143440 A0 20020421; JP 2002531961 A 20020924
DOCDB simple family (application)
GB 9904064 W 19991203; AU 1574600 A 19991203; CA 2350506 A 19991203; CN 99813805 A 19991203; EP 99958371 A 19991203; HK 02102596 A 20020408; IL 14344099 A 19991203; JP 2000586145 A 19991203