EP 1142457 A1 20011010 - METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD
Title (en)
METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD
Title (de)
VERFAHREN ZUM HERSTELLEN EINER MEHRLAGIGEN LEITERPLATTE
Title (fr)
PROCEDE DE FABRICATION D'UNE CARTE DE CIRCUITS IMPRIMES MULTICOUCHE
Publication
Application
Priority
- CH 9900625 W 19991224
- CH 799 A 19990105
Abstract (en)
[origin: WO0041447A1] The invention relates to a method for producing a multilayer printed circuit board which is produced by bonding laminate layers (20, 30, 40, 50) which each consist of a conductor layer (24, 25, 31, 32) and an insulating layer (16, 17; 28, 29) to a laminate core (10). According to the invention the via holes (33, 34) between the conductor layers (24, 32 and 25, 31) are formed by laser drilling through the individual laminate layers (40, 50) and then plated through.
IPC 1-7
IPC 8 full level
H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01)
CPC (source: EP)
H05K 1/115 (2013.01); H05K 3/0035 (2013.01); H05K 3/0038 (2013.01); H05K 3/4652 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/096 (2013.01); H05K 2203/0207 (2013.01); H05K 2203/0353 (2013.01); H05K 2203/108 (2013.01)
Citation (search report)
See references of WO 0041447A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 0041447 A1 20000713; AU 1646500 A 20000724; EP 1142457 A1 20011010
DOCDB simple family (application)
CH 9900625 W 19991224; AU 1646500 A 19991224; EP 99959169 A 19991224