Global Patent Index - EP 1144515 A1

EP 1144515 A1 20011017 - ACRYLATED OLIGOMER/THERMOPLASTIC POLYAMIDE PRESIZE COATINGS FOR ABRASIVE ARTICLE BACKINGS

Title (en)

ACRYLATED OLIGOMER/THERMOPLASTIC POLYAMIDE PRESIZE COATINGS FOR ABRASIVE ARTICLE BACKINGS

Title (de)

BESCHICHTUNGEN AUS ACRYLIERTEN OLIGOMEREN UND THERMOPLASTISCHEM POLYAMID FÜR HINTERLEGUNGEN VON SCHLEIFARTIKELN

Title (fr)

ENDUITS DE PRE-ENCOLLAGE EN POLYAMIDE THERMOPLASTIQUE/OLIGOMERE ACRYLE POUR SUPPORTS DORSAUX D'ARTICLES ABRASIFS

Publication

EP 1144515 A1 20011017 (EN)

Application

EP 99960250 A 19991109

Priority

  • US 9926426 W 19991109
  • US 21928998 A 19981222

Abstract (en)

[origin: WO0037569A1] The present invention provides a composition for use in coated abrasives. The curable composition comprises a mixture of: i) from about 25 to about 75 weight percent of acrylated oligomer; ii) from about 75 to about 25 weight percent of a thermoplastic polyamide miscible in said acrylated oligomer, the weight percents being based on the total resin content; and iii) a sufficient amount of a catalyst for the curable acrylated oligomer, said catalyst being stable at a temperature of mixing of the components. The present invention also provides single and multilayered treated backing substrates for use in coated abrasives.

IPC 1-7

C09D 4/06; B24D 3/28; B24D 3/00; C09D 177/00

IPC 8 full level

B24D 3/00 (2006.01); B24D 3/28 (2006.01); B32B 27/06 (2006.01); B32B 27/30 (2006.01); B32B 27/34 (2006.01); C08F 299/02 (2006.01); C08J 7/04 (2006.01); C08L 77/00 (2006.01); C09D 4/02 (2006.01); C09D 4/06 (2006.01); C09D 133/00 (2006.01); C09D 151/08 (2006.01); C09D 155/00 (2006.01); C09D 163/00 (2006.01); C09D 175/04 (2006.01); C09D 177/00 (2006.01)

CPC (source: EP)

B24D 3/004 (2013.01); B24D 3/28 (2013.01); C08L 77/00 (2013.01); C09D 4/06 (2013.01); C09D 177/00 (2013.01)

Citation (search report)

See references of WO 0037569A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

WO 0037569 A1 20000629; EP 1144515 A1 20011017; JP 2002533520 A 20021008

DOCDB simple family (application)

US 9926426 W 19991109; EP 99960250 A 19991109; JP 2000589631 A 19991109