EP 1144714 A1 20011017 - METHOD AND DEVICE FOR COATING SUBSTRATES BY MEANS OF BIPOLAR PULSE MAGNETRON SPUTTERING AND THE USE THEREOF
Title (en)
METHOD AND DEVICE FOR COATING SUBSTRATES BY MEANS OF BIPOLAR PULSE MAGNETRON SPUTTERING AND THE USE THEREOF
Title (de)
VERFAHREN UND EINRICHTUNG ZUM BESCHICHTEN VON SUBSTRATEN MITTELS BIPOLARER PULS-MAGNETRON-ZERSTÄUBUNG UND DEREN ANWENDUNG
Title (fr)
PROCEDE ET DISPOSITIF PERMETTANT DE RECOUVRIR DES SUBSTRATS PAR PULVERISATION MAGNETRON A IMPULSIONS BIPOLAIRES ET LEUR UTILISATION
Publication
Application
Priority
- DE 9904132 W 19991227
- DE 19860474 A 19981228
Abstract (en)
[origin: DE19860474A1] The invention relates to a method and device for coating substrates by means of bipolar pulse magnetron sputtering using three or more targets. The substrates are placed opposite the targets essentially in the range of a high plasma density, whereby at least two targets are connected to a potential-free bipolar power supply device and are sputtered for a predetermined period of time. The selection of the target respectively connected to the bipolar power supply device is altered during the course of the coating process according to a technologically predetermined program. The device is comprised of at least three magnetron sources (17, 17', 17'') provided with targets (18, 18', 18''), of a potential-free bipolar power supply device (21), and of a switching device (20) for switching the current electrical connection of selected targets with the bipolar power supply device (21) according to a technologically predetermined program.
IPC 1-7
IPC 8 full level
C23C 14/35 (2006.01); H01J 37/34 (2006.01)
CPC (source: EP US)
C23C 14/352 (2013.01 - EP US); H01J 37/3405 (2013.01 - EP US)
Citation (search report)
See references of WO 0039355A1
Designated contracting state (EPC)
CH LI SE
DOCDB simple family (publication)
DE 19860474 A1 20000706; EP 1144714 A1 20011017; US 6620299 B1 20030916; WO 0039355 A1 20000706
DOCDB simple family (application)
DE 19860474 A 19981228; DE 9904132 W 19991227; EP 99966899 A 19991227; US 86863601 A 20010627