EP 1145278 A1 20011017 - CATHODE HAVING VARIABLE MAGNET CONFIGURATION
Title (en)
CATHODE HAVING VARIABLE MAGNET CONFIGURATION
Title (de)
KATHODE MIT VARIABLER MAGNETKONFIGURATION
Title (fr)
CATHODE A CONFIGURATION VARIABLE DES AIMANTS
Publication
Application
Priority
US 9827250 W 19981221
Abstract (en)
[origin: WO0038214A1] A sputtering system (10) for depositing a thin film onto a substrate (148) is disclosed wherein the system includes an evacuatable chamber (12) which includes the substrate. In particular, the system includes a target (144) positioned within the chamber, wherein the target has a back surface and a sputtering surface (146). Further, the system includes plasma for eroding the target to provide material for forming the thin film wherein erosion of the target occurs in a predetermined erosion pattern and is controlled by a shape of the plasma. The system also includes a support (150) for supporting the substrate opposite the sputtering surface. A magnet arrangement is provided which provides a magnetic field on the target for controlling the shape of the plasma, wherein the magnet arrangement is positioned adjacent the back surface. The magnet arrangement (28) includes a plurality of magnet segments (36-50) which may be moved into desired positions so as to change the shape of the magnet arrangement. This enables adjustment of a dwell time of the magnetic field over predetermined portions of the target to change the shape of the plasma and thus change the erosion pattern of the target.
IPC 1-7
IPC 8 full level
C23C 14/35 (2006.01); H01J 37/34 (2006.01)
CPC (source: EP KR)
C23C 14/35 (2013.01 - KR); H01J 37/3408 (2013.01 - EP KR); H01J 37/3455 (2013.01 - EP KR)
Citation (search report)
See references of WO 0038214A1
Designated contracting state (EPC)
DE FR GB IT NL
DOCDB simple family (publication)
WO 0038214 A1 20000629; EP 1145278 A1 20011017; JP 2003531284 A 20031021; JP 3727849 B2 20051221; KR 100437867 B1 20040630; KR 20010108016 A 20011207
DOCDB simple family (application)
US 9827250 W 19981221; EP 98964215 A 19981221; JP 2000590193 A 19981221; KR 20017007322 A 20010612