EP 1145289 A1 20011017 - DEVICE AND METHOD FOR PROCESSING SUBSTRATES
Title (en)
DEVICE AND METHOD FOR PROCESSING SUBSTRATES
Title (de)
VORRICHTUNG UND VERFAHREN ZUM BEHANDELN VON SUBSTRATEN
Title (fr)
DISPOSITIF ET PROCEDE DE TRAITEMENT DE SUBSTRATS
Publication
Application
Priority
- DE 19859469 A 19981222
- EP 9908861 W 19991118
Abstract (en)
[origin: DE19859469A1] A device and method for processing substrates, especially semiconductor wafers, whereby a substrate holder containing a substrate is placed in a processing position above a first processing unit, first processing of the substrate occurs and the substrate holder is raised after said first processing. The invention enables further processing of the substrate to occur in a simple manner requiring little space, whereby the second processing unit moves between the raised substrate holder and the first processing unit and second processing of the substrate is carried out.
IPC 1-7
IPC 8 full level
H01L 21/677 (2006.01); H01L 21/00 (2006.01); H01L 21/304 (2006.01)
CPC (source: EP KR US)
H01L 21/00 (2013.01 - KR); H01L 21/67173 (2013.01 - EP US); H01L 21/6719 (2013.01 - EP US)
Citation (search report)
See references of WO 0038219A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
DE 19859469 A1 20000706; DE 19859469 C2 20020214; EP 1145289 A1 20011017; JP 2002533919 A 20021008; KR 20010089682 A 20011008; US 6488987 B1 20021203; WO 0038219 A1 20000629
DOCDB simple family (application)
DE 19859469 A 19981222; EP 9908861 W 19991118; EP 99956014 A 19991118; JP 2000590198 A 19991118; KR 20017007998 A 20010622; US 86921401 A 20010622