EP 1145316 A2 20011017 - POWER SEMICONDUCTOR MODULE
Title (en)
POWER SEMICONDUCTOR MODULE
Title (de)
LEISTUNGSHALBLEITERMODUL
Title (fr)
MODULE A SEMI-CONDUCTEUR DE PUISSANCE
Publication
Application
Priority
- DE 0003529 W 20001007
- DE 19950026 A 19991009
Abstract (en)
[origin: DE19950026A1] The invention relates to a power semiconductor module which comprises a stack of carrier substrates that are arranged in layers and one on top of the other and that are provided with at least one strip conductor on at least one main surface. At least one electronic semiconductor component is arranged between two adjacent carrier substrates of the stack. The semiconductor component is electrically contacted to at least one strip conductor of a carrier substrate that is arranged in the stack over the semiconductor component and to at least one additional strip conductor of a carrier substrate that is arranged in the stack under the semiconductor component and in such a way that heat is conducted. The aim of the invention is to provide improved heat emission and a construction that is as compact as possible at the same time. To this end, the two outer carrier substrates of the stack are configured as an upper and a lower wall of a closed housing component which surrounds the at least one semiconductor component. The gaps between the stacked carrier substrates are sealingly closed by means of a circulating wall that is fixed to the carrier substrates.
IPC 1-7
IPC 8 full level
H01L 23/538 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01)
CPC (source: EP KR US)
H01L 23/34 (2013.01 - KR); H01L 23/5385 (2013.01 - EP US); H01L 25/071 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)
C-Set (source: EP US)
Designated contracting state (EPC)
CH DE FR GB IT LI SE
DOCDB simple family (publication)
US 6697257 B1 20040224; DE 19950026 A1 20010412; DE 19950026 B4 20101111; EP 1145316 A2 20011017; EP 1145316 A3 20020213; HU 225864 B1 20071128; HU P0200604 A2 20020629; HU P0200604 A3 20030228; JP 2003511864 A 20030325; JP 4886137 B2 20120229; KR 100665933 B1 20070109; KR 20010104308 A 20011124; WO 0127997 A2 20010419; WO 0127997 A3 20011206
DOCDB simple family (application)
US 85780202 A 20020409; DE 0003529 W 20001007; DE 19950026 A 19991009; EP 00982969 A 20001007; HU P0200604 A 20001007; JP 2001530117 A 20001007; KR 20017007064 A 20010607