Global Patent Index - EP 1148962 B1

EP 1148962 B1 20021106 - METAL-CERAMIC LAMINAR-BAND COMPOSITE

Title (en)

METAL-CERAMIC LAMINAR-BAND COMPOSITE

Title (de)

METALLKERAMISCHER SCHICHTVERBUNDWERKSTOFF

Title (fr)

COMPOSITE A BANDES LAMINAIRES EN METAL-CERAMIQUE

Publication

EP 1148962 B1 20021106 (EN)

Application

EP 99900123 A 19990106

Priority

IL 9900010 W 19990106

Abstract (en)

[origin: WO0040359A1] A metal-ceramic laminar-band multi matrix composite, intended for use in oxidizing, reductive or inert media at temperatures up to 1500 DIVIDED 2800 DEG C and a method of the manufacture is provided. The composite material contains up to 85 vol. % of an oxide component, for example, yttria, zirconia, hafnia, up to 85 vol. % of a compound devoid of oxygen, such as zirconium carbide, and 15 DIVIDED 75 vol. % of a refractor metal, such as tungsten, molybdenum or chromium. Each of the above mentioned components of the composite exists in the form of a plurality of curved tapes. The tapes of every component are joined with the tapes of other components forming multilayer curved band-like chips, which are randomly interlaced in a compact 3-dimensional pattern of the chips. The novel composites have high mechanical properties, are thermal- and crack resistant, and have a good thermal-shock and oxidation-erosion resistance at temperatures of 1200 DEG C to 2800 DEG C.

IPC 1-7

B22F 3/00

IPC 8 full level

C04B 35/74 (2006.01); B22F 1/062 (2022.01); B22F 3/00 (2006.01); B22F 7/06 (2006.01); B22F 8/00 (2006.01); C22C 29/02 (2006.01); C22C 29/12 (2006.01); C22C 29/14 (2006.01); C22C 29/16 (2006.01)

CPC (source: EP US)

B22F 1/062 (2022.01 - EP US); B22F 3/002 (2013.01 - EP US); B22F 2998/10 (2013.01 - EP)

C-Set (source: EP)

B22F 2998/10 + B22F 3/22 + B22F 7/02 + B22F 2009/046

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

WO 0040359 A1 20000713; AT E227183 T1 20021115; AU 1781399 A 20000724; CA 2357713 A1 20000713; CN 1334759 A 20020206; DE 69903858 D1 20021212; DE 69903858 T2 20030717; EP 1148962 A1 20011031; EP 1148962 B1 20021106; JP 2002534345 A 20021015

DOCDB simple family (application)

IL 9900010 W 19990106; AT 99900123 T 19990106; AU 1781399 A 19990106; CA 2357713 A 19990106; CN 99816218 A 19990106; DE 69903858 T 19990106; EP 99900123 A 19990106; JP 2000592097 A 19990106