EP 1149422 A1 20011031 - METHOD AND APPARATUS FOR APPLYING A METALLIZATION PATTERN TO A SUBSTRATE FOR A PHOTOVOLTAIC CELL
Title (en)
METHOD AND APPARATUS FOR APPLYING A METALLIZATION PATTERN TO A SUBSTRATE FOR A PHOTOVOLTAIC CELL
Title (de)
VERFAHREN UND VORRICHTUNG ZUM AUFBRINGEN EINES METALLISCHEN MUSTERS AUF EIN SUBSTRAT FÜR EINE PHOTOVOLTAISCHE ZELLE
Title (fr)
PROCEDE ET APPAREIL D'APPLICATION D'UN MOTIF DE METALLISATION SUR UN SUBSTRAT POUR CELLULES PHOTOVOLTAIQUE
Publication
Application
Priority
- NL 0000026 W 20000114
- NL 1011081 A 19990120
Abstract (en)
[origin: WO0044051A1] Method for applying a metallization to at least one of the outer surfaces of a substrate for a photovoltaic element in accordance with a predetermined pattern of electrical conductors which comprises a set of relatively thin lines (fingers) and a set of relatively wide strips (busbars) connected thereto for transporting electrical charge carriers, which method comprises the steps of: (i) applying a metal-containing conductive paste to the relevant surface in accordance with said determined pattern, and (ii) drying the paste applied to the surface, wherein in the first step (i) a first paste for the set of the finger lines is applied using a stencil and a second paste for the set of the busbar strips is subsequently applied using an apparatus for contact-free application; apparatus for performing this method and photovoltaic element with substrate manufactured according to this method.
IPC 1-7
IPC 8 full level
H01L 31/0224 (2006.01); H01L 31/04 (2006.01); H05K 3/12 (2006.01)
CPC (source: EP)
H01L 31/022425 (2013.01); H05K 3/1241 (2013.01); H05K 3/1216 (2013.01); Y02E 10/50 (2013.01)
Citation (search report)
See references of WO 0044051A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 0044051 A1 20000727; AU 2331700 A 20000807; EP 1149422 A1 20011031; JP 2003536240 A 20031202; NL 1011081 C2 20000721
DOCDB simple family (application)
NL 0000026 W 20000114; AU 2331700 A 20000114; EP 00902199 A 20000114; JP 2000595386 A 20000114; NL 1011081 A 19990120