EP 1150016 A1 20011031 - Cooling system for vacuum pump and method for its realisation
Title (en)
Cooling system for vacuum pump and method for its realisation
Title (de)
Kühlungsanlage für Vakuumpumpe und Verfahren zur deren Ausführung
Title (fr)
Système de refroidissement de pompe à vide, et procédé pour sa réalisation
Publication
Application
Priority
FR 0004393 A 20000406
Abstract (en)
[origin: US2001028858A1] In accordance with the invention, the vacuum pump cooling system includes tubes expanded along their entire length in bores through the vacuum pump body. The tubes can be made of stainless steel, and inserted into a vacuum pump body made of cast iron. This prevents the risk of corrosion of the vacuum pump body by a cooling liquid passing through the tubes to cool the vacuum pump body.
Abstract (fr)
Selon l'invention, le système de refroidissement de pompe à vide comprend des tubes (8, 9) dudgeonnés selon toute leur longueur dans des alésages (6, 7) traversants du corps de pompe à vide (1). Les tubes (8, 9) peuvent être en acier inoxydable, engagés dans un corps de pompe à vide (1) en fonte. On évite ainsi tout risque de corrosion du corps de pompe à vide (1) par un liquide de refroidissement traversant les tubes (8, 9) pour refroidir le corps de pompe à vide (1). <IMAGE>
IPC 1-7
IPC 8 full level
F04B 39/06 (2006.01); B21D 39/06 (2006.01); B21D 39/08 (2006.01); B21D 39/20 (2006.01); B21D 51/16 (2006.01); F04B 37/16 (2006.01); F04C 29/04 (2006.01)
CPC (source: EP US)
F04C 29/04 (2013.01 - EP US); Y10T 29/49236 (2015.01 - EP US); Y10T 29/49803 (2015.01 - EP US)
Citation (applicant)
JP H05118288 A 19930514 - EBARA CORP
Citation (search report)
- [A] US 5292237 A 19940308 - ORIMO TAIJI [JP], et al
- [X] PATENT ABSTRACTS OF JAPAN vol. 017, no. 486 (M - 1473) 3 September 1993 (1993-09-03)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
US 2001028858 A1 20011011; US 6530762 B2 20030311; EP 1150016 A1 20011031; FR 2807477 A1 20011012; FR 2807477 B1 20020712; JP 2002005023 A 20020109
DOCDB simple family (application)
US 82533601 A 20010404; EP 01420076 A 20010330; FR 0004393 A 20000406; JP 2001104584 A 20010403