EP 1151471 A1 20011107 - METHOD FOR PROTECTING AN INTEGRATED CIRCUIT CHIP
Title (en)
METHOD FOR PROTECTING AN INTEGRATED CIRCUIT CHIP
Title (de)
VERFAHREN ZUM SCHUTZ EINES INTEGRIERTEN SCHALTUNGSCHIP
Title (fr)
PROCEDE DE PROTECTION DE PUCE DE CIRCUIT INTEGRE
Publication
Application
Priority
- FR 9903282 W 19991223
- FR 9900196 A 19990111
Abstract (en)
[origin: FR2788375A1] The invention concerns a method for protecting integrated circuit chips (100) of a silicon wafer (10) comprising the following steps: cutting out the silicon wafer (10) so as to disengage the chips from the integrated circuit; applying a fluid insulating material (150) on the rear surface (104) of the wafer so as to coat the flanks (106) of each chip (100) of the integrated circuit with a thin insulating layer. The insulating material may be applied by spraying, screen printing, dip coating, casting or any other means. The invention further concerns integrated circuit chips whereof the flanks are protected by an insulating material to prevent electrical malfunction caused by contact of a conductive material on the flanks of the chips.
IPC 1-7
IPC 8 full level
H01L 21/56 (2006.01); H01L 23/31 (2006.01)
CPC (source: EP US)
H01L 21/56 (2013.01 - EP US); H01L 21/561 (2013.01 - EP US); H01L 23/3171 (2013.01 - EP US); H01L 23/3185 (2013.01 - EP US); H01L 24/97 (2013.01 - EP US); H01L 2224/83191 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01015 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/01058 (2013.01 - EP US); H01L 2924/01074 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US)
Citation (search report)
See references of WO 0042653A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
FR 2788375 A1 20000713; FR 2788375 B1 20030718; AU 1986800 A 20000801; CN 1333919 A 20020130; EP 1151471 A1 20011107; US 6420211 B1 20020716; WO 0042653 A1 20000720
DOCDB simple family (application)
FR 9900196 A 19990111; AU 1986800 A 19991223; CN 99815562 A 19991223; EP 99963627 A 19991223; FR 9903282 W 19991223; US 88912101 A 20010711