EP 1153421 A1 20011114 - METHOD AND DEVICE FOR TREATING TABULAR SUBSTRATES, ESPECIALLY SILICON WAFERS FOR PRODUCING MICROELECTRONIC ELEMENTS
Title (en)
METHOD AND DEVICE FOR TREATING TABULAR SUBSTRATES, ESPECIALLY SILICON WAFERS FOR PRODUCING MICROELECTRONIC ELEMENTS
Title (de)
VERFAHREN UND VORRICHTUNG ZUM BEHANDELN VON FLÄCHIGEN SUBSTRATEN, INSBESONDERE SILIZIUM-SCHEIBEN (WAFER) ZUR HERSTELLUNG MIKROELEKTRONISCHER BAUELEMENTE
Title (fr)
PROCEDE ET DISPOSITIF DE TRAITEMENT DE SUBSTRATS PLATS, EN PARTICULIER DE TRANCHES DE SILICIUM POUR LA FABRICATION DE COMPOSANTS MICROELECTRONIQUES
Publication
Application
Priority
EP 9900252 W 19990118
Abstract (en)
[origin: WO0042637A1] The invention relates to a method and to a device for treating tabular substrates (5) according to which said substrate (5) is arranged in a narrow gap (62) between two plates (60, 61).
IPC 1-7
IPC 8 full level
H01L 21/00 (2006.01); H01L 21/304 (2006.01)
CPC (source: EP KR)
H01L 21/30 (2013.01 - KR); H01L 21/67051 (2013.01 - EP)
Citation (search report)
See references of WO 0042637A1
Designated contracting state (EPC)
AT CH DE FR GB IT LI NL
DOCDB simple family (publication)
WO 0042637 A1 20000720; AU 2518399 A 20000801; EP 1153421 A1 20011114; JP 2002535831 A 20021022; KR 20020018183 A 20020307
DOCDB simple family (application)
EP 9900252 W 19990118; AU 2518399 A 19990118; EP 99904791 A 19990118; JP 2000594139 A 19990118; KR 20017008992 A 20010716