Title (en)

METHOD FOR THE PRODUCTION OF A CHIP-CARD TYPE PORTABLE STORAGE MEDIUM

Title (de)

VERFAHREN ZUR HERSTELLUNG EINES EC-KARTENARTIGEN TRAGBAREN SPEICHERTRÄGERS

Title (fr)

PROCEDE DE FABRICATION DE SUPPORT DE MEMORISATION PORTABLE DE TYPE CARTE A PUCE

Publication

EP 1153432 A1 20011114 (FR)

Application

EP 00900651 A 20000124

Priority

• FR 0000151 W 20000124
• FR 9901454 A 19990208

Abstract (en)

[origin: FR2789505A1] The invention relates to a method for the production of chip-card type portable storage media comprising flush contact pads on a substrate in addition to an integrated circuit chip accommodated in a cavity formed in said media and provided with contact studs that are electrically connected to the flush contact pads. The inventive method includes a stage in which the contact pads are produced and another stage in which the substrate elements are installed and the integrated circuit chip is placed into the cavity. According to the invention, during the stage in which the contact pads are produced, conductive material is imprinted on the first surface of an adhesive dielectric film (100). In the installation stage, the second surface of the adhesive dielectric film (100) is fixed in said cavity. The invention can be used in the production of chip card modules and chip cards.

IPC 1-7

H01L 23/498; G06K 19/077

IPC 8 full level

G06K 19/077 (2006.01); H01L 21/48 (2006.01); H01L 21/60 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01)

CPC (source: EP)

G06K 19/07743 (2013.01); H01L 21/4867 (2013.01); H01L 23/13 (2013.01); H01L 23/49855 (2013.01); H01L 24/85 (2013.01); H01L 24/97 (2013.01); H01L 24/48 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/85 (2013.01); H01L 2224/85203 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01058 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01094 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/181 (2013.01)

Citation (search report)

See references of WO 0048250A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

FR 2789505 A1 20000811; FR 2789505 B1 20010309; AU 3059000 A 20000829; CN 1384979 A 20021211; EP 1153432 A1 20011114; WO 0048250 A1 20000817

DOCDB simple family (application)

FR 9901454 A 19990208; AU 3059000 A 20000124; CN 00803573 A 20000124; EP 00900651 A 20000124; FR 0000151 W 20000124