EP 1153749 A1 20011114 - A system and method for locally controlling the thickness of a flexible nozzle member
Title (en)
A system and method for locally controlling the thickness of a flexible nozzle member
Title (de)
System und Verfahren zur Lokalregelung der biegsamen Düsenplattendicke
Title (fr)
Système et méthode pour contrôler localement l'épaisseur d'une plaque à orifices flexible
Publication
Application
Priority
US 56958500 A 20000510
Abstract (en)
The present invention is embodied in a system (100) and method for locally controlling the thickness of a flexible nozzle member (306) of a printhead (300) portion of an inkjet printer (200). The printing system (100) of the present invention includes a printhead assembly (110) and an ink supply (112) for printing ink on print media (114). The printhead assembly (300) includes a printhead body (304), ink channels (424), a semiconductor wafer (410), a nozzle member (306) and a barrier layer (412) located between the wafer (410) and nozzle member (306). The nozzle member (306) has plural nozzles (420) coupled to respective ink channels (424) and is secured at a predefined location to the printhead body (304) with a suitable adhesive layer (432). The flexible member (306) has a mechanical feature (450) defining local thickness variations of the flexible nozzle member (306). The mechanical feature (450) can be defined in the flexible nozzle member (306) as extending in a range in close proximity to the ink channel (424) and the adhesive (432). The mechanical feature (450) reduces the stiffness of the flexible nozzle member (306) near the ink channel (424) or near the adhesive (432) for reducing the stress transmitted to an outside portion of the barrier layer (412). Thus, the present invention reduces trajectory errors of ejected ink droplets from the nozzles (420). <IMAGE>
IPC 1-7
IPC 8 full level
CPC (source: EP US)
B41J 2/1404 (2013.01 - EP US); B41J 2/1603 (2013.01 - EP US); B41J 2/162 (2013.01 - EP US); B41J 2/1623 (2013.01 - EP US); B41J 2/1626 (2013.01 - EP US); B41J 2/1632 (2013.01 - EP US); B41J 2/1634 (2013.01 - EP US); B41J 2002/14387 (2013.01 - EP US)
Citation (applicant)
- US 4490728 A 19841225 - VAUGHT JOHN L [US], et al
- US 4313684 A 19820202 - TAZAKI SHIGEMITSU, et al
Citation (search report)
- [XA] EP 0867292 A2 19980930 - LEXMARK INT INC [US]
- [A] EP 0997284 A2 20000503 - HEWLETT PACKARD CO [US]
- [A] US 5852460 A 19981222 - SCHAEFFER SARA E [US], et al
- [X] PATENT ABSTRACTS OF JAPAN vol. 014, no. 266 (M - 0982) 8 June 1990 (1990-06-08)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 1153749 A1 20011114; EP 1153749 B1 20051109; DE 60114701 D1 20051215; DE 60114701 T2 20060810; US 6467878 B1 20021022
DOCDB simple family (application)
EP 01303985 A 20010501; DE 60114701 T 20010501; US 56958500 A 20000510