EP 1154097 A1 20011114 - Tile with connection means, and process for laying such tile
Title (en)
Tile with connection means, and process for laying such tile
Title (de)
Fliese mit Verbindungsmittel und Verfahren zur deren Verlegung
Title (fr)
Carreau avec moyen de connection et procédé pour poser de tels carreaux
Publication
Application
Priority
IT TO20000434 A 20000511
Abstract (en)
A tile (1) is disclosed that is equipped with connection means (3), which are adapted to connect the tile (1) to immediately-adjacent tiles (1) thereby obtaining a complete seal against seepages of foreign substances into spaces between adjacent tiles (1). In particular, the connection means are composed of at least one band of plastic or tin material placed around the tile (1). A process is further disclosed for laying such tiles (1). <IMAGE>
IPC 1-7
IPC 8 full level
E04F 15/02 (2006.01)
CPC (source: EP)
E04F 15/02011 (2013.01); E04F 15/02016 (2013.01)
Citation (search report)
- [XA] WO 9934075 A1 19990708 - SUNDERLAND LIMITED [GB], et al
- [X] DE 19654320 A1 19970710 - CORONET SCHWARZA GMBH [DE]
- [A] FR 2315594 A1 19770121 - CTRE ETUD RECH IND BETON MANUF [FR]
- [A] DE 2505489 A1 19760819 - BUCHMAYER FRANZ
- [A] DE 4220770 A1 19940105 - LAUDENBERG HELMUT [DE]
- [A] WO 9749879 A1 19971231 - SCHIRRIS ALPHONS ALBERTUS [NL]
- [A] DE 2724128 A1 19781207 - REIGER LUDWIG
- [A] PATENT ABSTRACTS OF JAPAN vol. 2000, no. 05 14 September 2000 (2000-09-14)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
EP 1154097 A1 20011114; EP 1154097 B1 20050928; AT E305550 T1 20051015; DE 60113587 D1 20060209; ES 2250256 T3 20060416; IT 1320343 B1 20031126; IT TO20000434 A1 20000811
DOCDB simple family (application)
EP 01110970 A 20010507; AT 01110970 T 20010507; DE 60113587 T 20010507; ES 01110970 T 20010507; IT TO20000434 A 20000511