EP 1155420 A4 20040630 - BUS BAR ASSEMBLY
Title (en)
BUS BAR ASSEMBLY
Title (de)
SAMMELSCHIENEZUSAMMENBAU
Title (fr)
ENSEMBLE BARRE OMNIBUS
Publication
Application
Priority
US 9903804 W 19990222
Abstract (en)
[origin: WO0051141A1] A bus bar assembly (10) with improved solderabilty comprises a soldering island (70) with a central soldering opening (64) surrounded by thermal barrier openings (66).
IPC 1-7
IPC 8 full level
H05K 1/02 (2006.01); H05K 3/34 (2006.01); H05K 3/20 (2006.01)
CPC (source: EP)
H05K 1/0201 (2013.01); H05K 3/3447 (2013.01); H05K 1/0263 (2013.01); H05K 3/202 (2013.01); H05K 2201/062 (2013.01); H05K 2201/09118 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/10272 (2013.01)
Citation (search report)
- [Y] US 3372308 A 19680305 - NOSCHESE ROCCO J, et al
- [Y] WO 9833365 A1 19980730 - ERICSSON TELEFON AB L M [SE]
- [A] US 5832602 A 19981110 - UEZONO KOUICHI [JP], et al
- [Y] "CROSSED TWIN CIRCLE HEAT BLOCKAGE", IBM TECHNICAL DISCLOSURE BULLETIN, IBM CORP. NEW YORK, US, vol. 36, no. 11, 1 November 1993 (1993-11-01), pages 245 - 246, XP000424849, ISSN: 0018-8689
- See references of WO 0051141A1
Designated contracting state (EPC)
DE ES FR GB IT
DOCDB simple family (publication)
WO 0051141 A1 20000831; AU 2872899 A 20000914; EP 1155420 A1 20011121; EP 1155420 A4 20040630; JP 2002538749 A 20021112
DOCDB simple family (application)
US 9903804 W 19990222; AU 2872899 A 19990222; EP 99909545 A 19990222; JP 2000601657 A 19990222