Global Patent Index - EP 1155420 A4

EP 1155420 A4 20040630 - BUS BAR ASSEMBLY

Title (en)

BUS BAR ASSEMBLY

Title (de)

SAMMELSCHIENEZUSAMMENBAU

Title (fr)

ENSEMBLE BARRE OMNIBUS

Publication

EP 1155420 A4 20040630 (EN)

Application

EP 99909545 A 19990222

Priority

US 9903804 W 19990222

Abstract (en)

[origin: WO0051141A1] A bus bar assembly (10) with improved solderabilty comprises a soldering island (70) with a central soldering opening (64) surrounded by thermal barrier openings (66).

IPC 1-7

H05K 1/02

IPC 8 full level

H05K 1/02 (2006.01); H05K 3/34 (2006.01); H05K 3/20 (2006.01)

CPC (source: EP)

H05K 1/0201 (2013.01); H05K 3/3447 (2013.01); H05K 1/0263 (2013.01); H05K 3/202 (2013.01); H05K 2201/062 (2013.01); H05K 2201/09118 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/10272 (2013.01)

Citation (search report)

  • [Y] US 3372308 A 19680305 - NOSCHESE ROCCO J, et al
  • [Y] WO 9833365 A1 19980730 - ERICSSON TELEFON AB L M [SE]
  • [A] US 5832602 A 19981110 - UEZONO KOUICHI [JP], et al
  • [Y] "CROSSED TWIN CIRCLE HEAT BLOCKAGE", IBM TECHNICAL DISCLOSURE BULLETIN, IBM CORP. NEW YORK, US, vol. 36, no. 11, 1 November 1993 (1993-11-01), pages 245 - 246, XP000424849, ISSN: 0018-8689
  • See references of WO 0051141A1

Designated contracting state (EPC)

DE ES FR GB IT

DOCDB simple family (publication)

WO 0051141 A1 20000831; AU 2872899 A 20000914; EP 1155420 A1 20011121; EP 1155420 A4 20040630; JP 2002538749 A 20021112

DOCDB simple family (application)

US 9903804 W 19990222; AU 2872899 A 19990222; EP 99909545 A 19990222; JP 2000601657 A 19990222