EP 1155449 A1 20011121 - SEMICONDUCTOR COMPONENT WITH A CHIP CARRIER WITH OPENINGS FOR CONTACTING
Title (en)
SEMICONDUCTOR COMPONENT WITH A CHIP CARRIER WITH OPENINGS FOR CONTACTING
Title (de)
HALBLEITERBAUELEMENT MIT EINEM CHIPTRÄGER MIT ÖFFNUNGEN ZUR KONTAKTIERUNG DURCH EINE METALLFOLIE
Title (fr)
COMPOSANT A SEMICONDUCTEUR COMPORTANT UN PORTE-PUCE AVEC DES OUVERTURES POUR LA METALLISATION
Publication
Application
Priority
- DE 0000328 W 20000203
- DE 19905055 A 19990208
Abstract (en)
[origin: DE19905055A1] Disclosed is a semiconductor component comprising at least one semiconductor chip (2), a chip carrier (1) for mounting the semiconductor chip (2) onto a first surface (8) of the chip carrier (2) and contact points (6) which are electrically connected to the semiconductor chip (2) and which are provided with a conductive connection via openings (20) of the chip carrier (1) to solder terminals (5) in the area of a second surface (9) of the chip carrier (1). The solder terminals (5) are formed from a metal film (7) which lines the openings (20), extends from the first surface (8) through the openings (20) to the second surface (9) and can be directly contacted. The semiconductor component also comprises an opening (10) in the chip carrier below the semiconductor chip (2). A metal film (11) which lines said opening (10) is situated between the chip carrier (1) and the semiconductor chip (2) so as to form a solder terminal.
IPC 1-7
IPC 8 full level
H01L 23/31 (2006.01); H01L 23/498 (2006.01); H05K 3/34 (2006.01); H05K 3/40 (2006.01)
CPC (source: EP US)
H01L 23/3121 (2013.01 - EP US); H01L 23/3128 (2013.01 - EP US); H01L 23/49816 (2013.01 - EP US); H01L 23/49827 (2013.01 - EP US); H05K 3/3436 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 2224/05599 (2013.01 - EP US); H01L 2224/16225 (2013.01 - EP US); H01L 2224/32245 (2013.01 - EP US); H01L 2224/32257 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48137 (2013.01 - EP US); H01L 2224/48247 (2013.01 - EP US); H01L 2224/48465 (2013.01 - EP US); H01L 2224/73204 (2013.01 - EP US); H01L 2224/73265 (2013.01 - EP US); H01L 2224/85385 (2013.01 - EP US); H01L 2224/854 (2013.01 - EP US); H01L 2224/92 (2013.01 - EP US); H01L 2224/92247 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01057 (2013.01 - EP US); H01L 2924/01068 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/13091 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US); H01L 2924/15313 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US); H01L 2924/3025 (2013.01 - EP US); H05K 3/4084 (2013.01 - EP US); H05K 2201/0394 (2013.01 - EP US); Y02P 70/50 (2015.11 - EP US)
Citation (search report)
See references of WO 0048249A1
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
DE 19905055 A1 20000817; EP 1155449 A1 20011121; US 2002041014 A1 20020411; US 6528877 B2 20030304; WO 0048249 A1 20000817
DOCDB simple family (application)
DE 19905055 A 19990208; DE 0000328 W 20000203; EP 00912347 A 20000203; US 92517101 A 20010808