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EP 1155969 B1 20060215 - Solder ball container

Title (en)

Solder ball container

Title (de)

Behälter für Lötkugeln

Title (fr)

Récipient pour billes de soudure

Publication

EP 1155969 B1 20060215 (EN)

Application

EP 00401387 A 20000519

Priority

EP 00401387 A 20000519

Abstract (en)

[origin: EP1155969A1] A cylindrical container (1) with a bottom has an opening (4) in which a projection (8) is installed, the projection having a shape which will not deform solder balls (B) when inserted into a packet layer of solder balls within the container. Its shape is such that its cross section has a streamlined or inverted conical shape, or it is cylindrical with a tip having a semi-spherical or inverted conical shape. Blackening, electrical charging, and deformation of solder balls packed in the container can be prevented during transport. <IMAGE>

IPC 8 full level

B65D 51/26 (2006.01); H01L 21/00 (2006.01)

CPC (source: EP)

B65D 51/26 (2013.01)

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

EP 1155969 A1 20011121; EP 1155969 B1 20060215; DE 60026004 D1 20060420; DE 60026004 T2 20060831

DOCDB simple family (application)

EP 00401387 A 20000519; DE 60026004 T 20000519