EP 1157075 A1 20011128 - SEALANT COMPOSITIONS AND SEALANT ARTICLES USING THE SAME
Title (en)
SEALANT COMPOSITIONS AND SEALANT ARTICLES USING THE SAME
Title (de)
DICHTUNGSMITTELZUSAMMENSETZUNG UND DICHTUNGSGEGENSTÄNDE DIE DIESE ZUSAMMENSETZUNG VERWENDEN
Title (fr)
COMPOSITIONS DE SCELLEMENT ET ARTICLES DE SCELLEMENT UTILISANT CES COMPOSITIONS
Publication
Application
Priority
- JP 37389298 A 19981228
- US 9930325 W 19991220
Abstract (en)
[origin: WO0039235A1] A sealant composition comprising a curable epoxy-containing material, a thermoplastic polyamide component having a melting point lower than a curing temperature of the epoxy-containing material, and a curative for the epoxy-containing material. After curing of the epoxy-containing material, the sealant composition exhibits an elongation at -20 DEG C of at least 2 . The sealant composition is capable of effectively sealing discontinuities while maintaining enough flexibility to absorb applied stress, thereby preventing the formation of defects in the sealant which permit the intrusion of dirt, moisture, and other undesirable substances.
IPC 1-7
C09J 177/00; C09J 177/08; C09J 163/00; C09J 7/02; C08L 63/00; C08L 77/00
IPC 8 full level
C08J 7/04 (2006.01); B32B 27/38 (2006.01); C08G 59/50 (2006.01); C08L 63/00 (2006.01); C08L 77/00 (2006.01); C09J 7/10 (2018.01); C09K 3/10 (2006.01)
CPC (source: EP KR US)
B32B 27/28 (2013.01 - KR); B32B 27/38 (2013.01 - KR); C08J 7/04 (2013.01 - KR); C08L 63/00 (2013.01 - EP KR); C08L 77/00 (2013.01 - EP KR); C09J 7/10 (2017.12 - EP KR US); C09J 7/29 (2017.12 - KR); C09J 7/30 (2017.12 - KR); C09J 7/35 (2017.12 - EP); C09K 3/10 (2013.01 - EP KR US); C09J 2301/204 (2020.08 - EP); C09J 2301/208 (2020.08 - EP); C09J 2301/412 (2020.08 - EP); C09J 2463/00 (2013.01 - EP KR); C09J 2467/006 (2013.01 - EP); C09J 2477/00 (2013.01 - EP KR); C09K 2200/0429 (2013.01 - EP); C09K 2200/0647 (2013.01 - EP KR); C09K 2200/0667 (2013.01 - EP KR)
Citation (search report)
See references of WO 0039235A1
Designated contracting state (EPC)
AT DE FR GB IT
DOCDB simple family (publication)
WO 0039235 A1 20000706; AU 2198900 A 20000731; CA 2353882 A1 20000706; CN 1198896 C 20050427; CN 1332778 A 20020123; EP 1157075 A1 20011128; JP 2000192013 A 20000711; JP 2002533557 A 20021008; JP 4471500 B2 20100602; KR 20010101322 A 20011114
DOCDB simple family (application)
US 9930325 W 19991220; AU 2198900 A 19991220; CA 2353882 A 19991220; CN 99815167 A 19991220; EP 99966458 A 19991220; JP 2000591136 A 19991220; JP 37389298 A 19981228; KR 20017008211 A 20010627