Global Patent Index - EP 1159085 A4

EP 1159085 A4 20040811 - SPRAY DEPOSITION PROCESS

Title (en)

SPRAY DEPOSITION PROCESS

Title (de)

SPRÜHBESCHICHTUNGSVERFAHREN

Title (fr)

PROCEDE DE DEPOT PAR PULVERISATION

Publication

EP 1159085 A4 20040811 (EN)

Application

EP 00913569 A 20000223

Priority

  • GB 9903964 A 19990223
  • US 0004494 W 20000223

Abstract (en)

[origin: WO0050177A1] A process for producing a metallic tool, mould, die or other body of significant thickness or a coating, the process comprising directing a spray (3, 4) comprising molten metallic droplets carried by a propelling gas toward an object surface (7) of a substrate or pattern (5) so as to build up a metallic deposit or coating comprising the mould, tool, die, body or coating on the object surface (7) of the substrate or pattern (5), wherein at one or more predetermined stages during spraying droplets of a relatively large mean size are sprayed and at one or more other stages droplets or a relatively smaller mean size are sprayed.

IPC 1-7

B22D 23/00; C23C 4/08; C23C 4/00; C23C 4/12

IPC 8 full level

B22D 23/00 (2006.01); C23C 4/02 (2006.01); C23C 4/12 (2006.01)

CPC (source: EP)

B22D 23/003 (2013.01); C23C 4/02 (2013.01); C23C 4/12 (2013.01); C23C 4/123 (2016.01); C23C 4/131 (2016.01)

Citation (search report)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

WO 0050177 A1 20000831; AT E306343 T1 20051015; DE 60023120 D1 20060223; DE 60023120 T2 20060907; EP 1159085 A1 20011205; EP 1159085 A4 20040811; EP 1159085 B1 20051012; EP 1159085 B8 20051228; ES 2251364 T3 20060501; GB 9903964 D0 19990414

DOCDB simple family (application)

US 0004494 W 20000223; AT 00913569 T 20000223; DE 60023120 T 20000223; EP 00913569 A 20000223; ES 00913569 T 20000223; GB 9903964 A 19990223