Global Patent Index - EP 1161331 A1

EP 1161331 A1 20011212 - PROCESSES FOR PREPARING MOLDED COMPOSITE MATERIAL USING WAX-BASED RELEASE AGENTS

Title (en)

PROCESSES FOR PREPARING MOLDED COMPOSITE MATERIAL USING WAX-BASED RELEASE AGENTS

Title (de)

VERFAHREN ZUR HERSTELLUNG VON GEFORMTEM VERBUNDSTOFF UNTER VERWENDUNG VON AUF WACHS BASIERENDEN TRENNMITTELN

Title (fr)

PROCEDES POUR LA PREPARATION D'UN MATERIAU COMPOSITE MOULE, ET AGENTS DE DECOLLEMENT A BASE DE CIRE

Publication

EP 1161331 A1 20011212 (EN)

Application

EP 00917811 A 20000309

Priority

  • US 0006099 W 20000309
  • US 12430799 P 19990312

Abstract (en)

[origin: WO0053381A1] The invention provides methods of preparing molded composite materials such as oriented strand board, waferboard or plywood in a press plate-containing apparatus using waxes and emulsions containing the same wax having specifically defined ranges of physical characteristics. The methods include a) treating the press plate surfaces of a molding apparatus which contact a composite mixture with an effective amount of an oxidized wax having a Brookfield viscosity which is less than about 80 mPas at 149 DEG C, a droppoint of from about 80 to about 120 DEG C and a hardness of less than about 18 decimillimeters (dmm) at 25 DEG C, prior to the composite material contacting the press plate surfaces, and thereafter b) applying the wax-treated press plate surfaces to the composite mixture under conditions sufficient to mold the composite.

IPC 1-7

B27N 3/08; B29C 33/62

IPC 8 full level

B27N 3/08 (2006.01); B29C 33/62 (2006.01)

CPC (source: EP)

B27N 3/083 (2013.01); B29C 33/62 (2013.01)

Citation (search report)

See references of WO 0053381A1

Designated contracting state (EPC)

BE DE FR IE

DOCDB simple family (publication)

WO 0053381 A1 20000914; AU 3872400 A 20000928; CA 2362750 A1 20000914; EP 1161331 A1 20011212; JP 2003525767 A 20030902; PL 350544 A1 20021216

DOCDB simple family (application)

US 0006099 W 20000309; AU 3872400 A 20000309; CA 2362750 A 20000309; EP 00917811 A 20000309; JP 2000603849 A 20000309; PL 35054400 A 20000309