Global Patent Index - EP 1161784 A1

EP 1161784 A1 2001-12-12 - ENCLOSURE FOR HARDWARE

Title (en)

ENCLOSURE FOR HARDWARE

Title (de)

GEHÄUSE FÜR HARDWARE

Title (fr)

ENCEINTE POUR MATERIEL

Publication

EP 1161784 A1 (EN)

Application

EP 00911035 A

Priority

  • GB 0000950 W
  • GB 9906082 A

Abstract (en)

[origin: WO0055951A1] An enclosure (1) for conduction-cooled hardware comprises a frame of corner pieces (2) and intermediate linking pieces (3). The corner pieces (2) (and maybe the pieces (3)) are formed by casting and machining. Panels are added to this frame to complete the enclosure (1). The corner pieces (2) have projecting portions that project through a significant distance. A range of different-sized linking pieces is provided so that different-sized enclosures can be assembled.

IPC 1-7 (main, further and additional classification)

H02B 1/30

IPC 8 full level (invention and additional information)

H02B 1/30 (2006.01); H02B 1/01 (2006.01)

CPC (invention and additional information)

H02B 1/301 (2013.01); H02B 1/014 (2013.01)

Citation (search report)

See references of WO 0055951A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

EPO simple patent family

WO 0055951 A1 20000921; AU 3303500 A 20001004; CA 2402376 A1 20010921; EP 1161784 A1 20011212; GB 9906082 D0 19990512

INPADOC legal status


2008-05-28 [18D] APPLICATION DEEMED TO BE WITHDRAWN

- Effective date: 20071211

2005-07-27 [17Q] FIRST EXAMINATION REPORT

- Effective date: 20050613

2001-12-12 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20010901

2001-12-12 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A1

- Designated State(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE