Global Patent Index - EP 1163112 A1

EP 1163112 A1 20011219 - PLASTICIZER-ASSISTED BOND FORMATION USEFUL FOR DEFECT-FREE LAMINATION

Title (en)

PLASTICIZER-ASSISTED BOND FORMATION USEFUL FOR DEFECT-FREE LAMINATION

Title (de)

MITTELS WEICHMACHER UNTERSTÜTZTE VERBINDUNG FÜR DEFEKTFREIE LAMINIERUNG

Title (fr)

FORMATION DE LIAISON A L'AIDE DE PLASTIFIANT, UTILE POUR STRATIFIES EXEMPTS DE DEFAUT

Publication

EP 1163112 A1 20011219 (EN)

Application

EP 99914949 A 19990319

Priority

US 9906016 W 19990319

Abstract (en)

[origin: WO0056543A1] Laminated articles of the present invention are prepared using at least substrate to be bonded, a polymeric film, and a non-volatile plasticizer for coating at least one surface of the substrate or polymeric film to be bonded. Upon absorption of the plasticizer into the polymeric film, a laminate article is formed. Preferred laminates are useful in optical applications and do not require elevated temperatures and non-atmospheric pressures for timely bonding. Kits comprising an amorphous polymeric film and a sufficient amount of a non-volatile plasticizer for forming a laminate comprising the amorphous polymeric film and a substrate are also useful for practicing the method of the invention.

IPC 1-7

B32B 17/10; B32B 27/22; B32B 7/04; C08J 5/12; B32B 31/00

IPC 8 full level

B29C 65/48 (2006.01); B32B 7/04 (2006.01); B32B 17/10 (2006.01); B32B 37/24 (2006.01); C08J 5/12 (2006.01); B29L 7/00 (2006.01); B29L 9/00 (2006.01)

CPC (source: EP US)

B32B 7/04 (2013.01 - EP); B32B 7/12 (2013.01 - US); B32B 17/10743 (2013.01 - EP); B32B 17/10779 (2013.01 - EP); B32B 37/0007 (2013.01 - EP); B32B 37/12 (2013.01 - EP US); C08J 5/122 (2013.01 - EP); B32B 2307/412 (2013.01 - EP US); B32B 2307/702 (2013.01 - EP); B32B 2309/027 (2013.01 - US); B32B 2309/04 (2013.01 - US); B32B 2315/08 (2013.01 - EP)

Citation (search report)

See references of WO 0056543A1

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

WO 0056543 A1 20000928; AU 3357999 A 20001009; EP 1163112 A1 20011219; JP 2002539973 A 20021126

DOCDB simple family (application)

US 9906016 W 19990319; AU 3357999 A 19990319; EP 99914949 A 19990319; JP 2000606423 A 19990319