EP 1163488 A1 20011219 - METHOD AND APPARATUS FOR WAFER METROLOGY
Title (en)
METHOD AND APPARATUS FOR WAFER METROLOGY
Title (de)
VERFAHREN UND VORRICHTUNG FÜR DIE MESSUNG AN WAFERN
Title (fr)
PROCEDE ET APPAREIL DE METROLOGIE DE PLAQUETTE
Publication
Application
Priority
- US 0007709 W 20000322
- US 12546299 P 19990322
- US 12891599 P 19990412
- US 14319999 P 19990709
- US 17285199 P 19991210
- US 49582100 A 20000201
Abstract (en)
[origin: WO0057127A1] This invention is an apparatus for imaging metrology, which in particular embodiments may be integrated with a processor station such that a metrology station is apart from but coupled to a process station. The metrology station is provided with a first imaging camera with a first field of view containing the measurement region. Alternate embodiments include a second imaging camera with a second field of view. Preferred embodiments comprise a broadband ultraviolet light source, although other embodiments may have a visible or near infrared light source of broad or narrow optical bandwidth. Embodiments including a broad bandwidth source typically include a spectrograph, or an imaging spectrograph. Particular embodiments may include curved, reflective optics or a measurement region wetted by a liquid. In a typical embodiment, the metrology station and the measurement region are configured to have 4 degrees of freedom of movement relative to each other.
IPC 1-7
IPC 8 full level
B24B 49/12 (2006.01); G01B 11/06 (2006.01); G01B 11/24 (2006.01); G01B 11/30 (2006.01); G01N 21/95 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); G01N 21/21 (2006.01)
CPC (source: EP)
B24B 49/12 (2013.01); G01B 11/0625 (2013.01); G01B 11/30 (2013.01); G01N 21/9501 (2013.01); H01L 21/67 (2013.01); G01N 21/211 (2013.01); H01L 22/12 (2013.01)
Citation (search report)
See references of WO 0057127A1
Citation (examination)
- US 4402613 A 19830906 - DALY JOHN K [US], et al
- US 4505585 A 19850319 - YOSHIKAWA SHOJI [JP], et al
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 0057127 A1 20000928; WO 0057127 A9 20020328; AU 4175800 A 20001009; EP 1163488 A1 20011219; JP 2002540388 A 20021126; TW 493205 B 20020701
DOCDB simple family (application)
US 0007709 W 20000322; AU 4175800 A 20000322; EP 00921435 A 20000322; JP 2000606954 A 20000322; TW 89105382 A 20000322