Global Patent Index - EP 1163488 A1

EP 1163488 A1 2001-12-19 - METHOD AND APPARATUS FOR WAFER METROLOGY

Title (en)

METHOD AND APPARATUS FOR WAFER METROLOGY

Title (de)

VERFAHREN UND VORRICHTUNG FÜR DIE MESSUNG AN WAFERN

Title (fr)

PROCEDE ET APPAREIL DE METROLOGIE DE PLAQUETTE

Publication

EP 1163488 A1 (EN)

Application

EP 00921435 A

Priority

  • US 0007709 W
  • US 12546299 P
  • US 12891599 P
  • US 14319999 P
  • US 17285199 P
  • US 49582100 A

Abstract (en)

[origin: WO0057127A1] This invention is an apparatus for imaging metrology, which in particular embodiments may be integrated with a processor station such that a metrology station is apart from but coupled to a process station. The metrology station is provided with a first imaging camera with a first field of view containing the measurement region. Alternate embodiments include a second imaging camera with a second field of view. Preferred embodiments comprise a broadband ultraviolet light source, although other embodiments may have a visible or near infrared light source of broad or narrow optical bandwidth. Embodiments including a broad bandwidth source typically include a spectrograph, or an imaging spectrograph. Particular embodiments may include curved, reflective optics or a measurement region wetted by a liquid. In a typical embodiment, the metrology station and the measurement region are configured to have 4 degrees of freedom of movement relative to each other.

IPC 1-7 (main, further and additional classification)

G01B 11/06; C23C 16/52; G01N 21/88; H01L 21/304; H01L 21/66

IPC 8 full level (invention and additional information)

B24B 49/12 (2006.01); G01B 11/06 (2006.01); G01B 11/24 (2006.01); G01B 11/30 (2006.01); G01N 21/95 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); G01N 21/21 (2006.01)

CPC (invention and additional information)

B24B 49/12 (2013.01); G01B 11/0625 (2013.01); G01B 11/30 (2013.01); G01N 21/9501 (2013.01); H01L 21/67 (2013.01); G01N 21/211 (2013.01); H01L 22/12 (2013.01)

Citation (search report)

See references of WO 0057127A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

EPO simple patent family

WO 0057127 A1 20000928; WO 0057127 A9 20020328; AU 4175800 A 20001009; EP 1163488 A1 20011219; JP 2002540388 A 20021126; TW 493205 B 20020701

INPADOC legal status


2005-04-13 [18D] DEEMED TO BE WITHDRAWN

- Effective date: 20041008

2002-07-24 [17Q] FIRST EXAMINATION REPORT

- Effective date: 20020607

2001-12-19 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20011004

2001-12-19 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A1

- Designated State(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

2001-12-19 [AX] REQUEST FOR EXTENSION OF THE EUROPEAN PATENT TO

- Free text: AL;LT;LV;MK;RO;SI