EP 1163704 A1 20011219 - METAL SPONGES FOR RAPID SURFACE-CHEMICAL REACTIONS

Title (en)

METAL SPONGES FOR RAPID SURFACE-CHEMICAL REACTIONS

Title (de)

METALLSCHWÄMME FÜR SCHNELLE CHEMISCHE OBERFLÄCHENREAKTIONEN

Title (fr)

EPONGES METALLIQUES POUR REACTIONS CHIMIQUES RAPIDES EN SURFACE

Publication

EP 1163704 A1 20011219 (EN)

Application

EP 00914963 A 20000315

Priority

US 0006724 W 20000315
US 12444399 P 19990315

Abstract (en)

[origin: WO0055931A1] Surfaces suited to performing chemical reactions thereon are provided by a sponge material (16) having fine dendrites (18). The sponge material may be formed by growing the dendrites on a substrate (14) or particles of the sponge material may be sintered onto a substrate. The sponge material is suitable for use as an anode (10) or a cathode (12) in a battery (1). The sponge material may be coated with another material, which acts as a catalyst, or which improves the electrical conductivity of the sponge.

IPC 1-7

H01M 4/64; H01M 4/70; H01M 4/30; C01B 6/02; C25C 5/02

IPC 8 full level

C22B 9/04 (2006.01); C22B 34/10 (2006.01); C22B 34/14 (2006.01); H01M 4/02 (2006.01); H01M 4/12 (2006.01); H01M 4/13 (2010.01); H01M 4/24 (2006.01); H01M 4/38 (2006.01); H01M 4/64 (2006.01); H01M 4/66 (2006.01); H01M 4/80 (2006.01); H01M 4/86 (2006.01); H01M 4/46 (2006.01)

CPC (source: EP KR)

H01M 4/12 (2013.01 - EP); H01M 4/13 (2013.01 - EP); H01M 4/244 (2013.01 - EP); H01M 4/248 (2013.01 - EP); H01M 4/38 (2013.01 - EP); H01M 4/64 (2013.01 - KR); H01M 4/808 (2013.01 - EP); H01M 4/8621 (2013.01 - EP); B82Y 30/00 (2013.01 - KR); H01M 4/463 (2013.01 - EP); Y02E 60/10 (2013.01 - EP); Y02E 60/50 (2013.01 - EP)

Citation (search report)

See references of WO 0055931A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

WO 0055931 A1 20000921; AU 3627600 A 20001004; CA 2367990 A1 20000921; EP 1163704 A1 20011219; IL 145390 A0 20020630; JP 2002539595 A 20021119; KR 20020012161 A 20020215

DOCDB simple family (application)

US 0006724 W 20000315; AU 3627600 A 20000315; CA 2367990 A 20000315; EP 00914963 A 20000315; IL 14539000 A 20000315; JP 2000605277 A 20000315; KR 20017011720 A 20010914