EP 1163827 A1 20011219 - METHOD FOR PRODUCING SOLDERABLE AND FUNCTIONAL SURFACES ON CIRCUIT CARRIERS
Title (en)
METHOD FOR PRODUCING SOLDERABLE AND FUNCTIONAL SURFACES ON CIRCUIT CARRIERS
Title (de)
VERFAHREN ZUM ERZEUGEN VON LÖTFÄHIGEN UND FUNKTIONELLEN OBERFLÄCHEN AUF SCHALTUNGSTRÄGERN
Title (fr)
PROCEDE POUR REALISER DES SURFACES APTES AU BRASAGE ET FONCTIONNELLES SUR DES SUPPORT DE CIRCUITS
Publication
Application
Priority
- DE 0101232 W 20010328
- DE 10018025 A 20000404
Abstract (en)
[origin: WO0176334A1] The inventive method provides solderable areas in addition to bondable areas on circuit carriers, wherein solderability is not impaired by exposing the circuit carriers to the effects of temperature. The inventive method comprises the following steps: solderable surfaces are produced by deposition of a solderable metal layer (5), the solder areas are covered by a mask (6), functional surfaces (7, 8) are created in the functional areas and the covering mask (6) is finally removed.
IPC 1-7
IPC 8 full level
H05K 3/24 (2006.01)
CPC (source: EP KR US)
H05K 3/02 (2013.01 - KR); H05K 3/243 (2013.01 - EP US); H05K 2201/0391 (2013.01 - EP US); H05K 2203/0361 (2013.01 - EP US); Y10T 29/49144 (2015.01 - EP US)
Citation (search report)
See references of WO 0176334A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 0176334 A1 20011011; CA 2365701 A1 20011011; DE 10018025 A1 20011018; EP 1163827 A1 20011219; HK 1040880 A1 20020621; KR 20020042524 A 20020605; US 2003052157 A1 20030320; US 6698648 B2 20040302
DOCDB simple family (application)
DE 0101232 W 20010328; CA 2365701 A 20010328; DE 10018025 A 20000404; EP 01927633 A 20010328; HK 02102552 A 20020404; KR 20017011206 A 20010903; US 93736302 A 20020117