EP 1164437 A2 20011219 - Lithographic system
Title (en)
Lithographic system
Title (de)
Lithographisches System
Title (fr)
Système lithographique
Publication
Application
Priority
- JP 2000179407 A 20000615
- JP 2001148056 A 20010517
Abstract (en)
The exposure apparatus (10) and the substrate processing unit (50) are connected via an in-line I/F portion (110). In addition, information on the substrate carriage is communicated in between the control unit of the exposure apparatus side and the control unit of the substrate processing unit, and both units decide their next operation that contribute to improving the processing capacity related to the wafer carriage, before actually starting the operation. Therefore, the throughput of the series of wafer processing performed by the substrate processing unit and the exposure apparatus can be improved, and as a consequence, becomes possible to improve the productivity of the device. In this case, for example, information on the predicted time or the expected time when the substrate can be received or sent out is reciprocally communicated between both units. <IMAGE>
IPC 1-7
IPC 8 full level
G03F 7/20 (2006.01); H01L 21/027 (2006.01); H01L 21/677 (2006.01)
CPC (source: EP KR US)
G03F 7/70716 (2013.01 - EP US); G03F 7/708 (2013.01 - EP US); H01L 21/027 (2013.01 - KR)
Citation (examination)
- JP H09283424 A 19971031 - CANON KK
- JP H08255750 A 19961001 - TOKYO ELECTRON LTD, et al
- US 5841515 A 19981124 - OHTANI MASAMI [JP]
- EP 0915507 A1 19990512 - TOKYO ELECTRON LTD [JP]
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
EP 1164437 A2 20011219; EP 1164437 A3 20040211; CN 1248054 C 20060329; CN 1330292 A 20020109; JP 2002075853 A 20020315; JP 4915033 B2 20120411; KR 100752083 B1 20070824; KR 20010113001 A 20011224; SG 101453 A1 20040130; TW I244118 B 20051121; US 2001053291 A1 20011220; US 2003231289 A1 20031218; US 6698944 B2 20040302
DOCDB simple family (application)
EP 01305175 A 20010614; CN 01118812 A 20010614; JP 2001148056 A 20010517; KR 20010032099 A 20010608; SG 200103491 A 20010613; TW 90114532 A 20010615; US 44375803 A 20030523; US 88006701 A 20010614