EP 1166283 B1 20031015 - COATING COMPOSITION FOR METALLIC CONDUCTORS AND COATING METHOD USING SAME
Title (en)
COATING COMPOSITION FOR METALLIC CONDUCTORS AND COATING METHOD USING SAME
Title (de)
BESCHICHTUNGSZUSAMMENSETZUNG FÜR METALLISCHE LEITER UND BESCHICHTUNGSVERFAHREN UNTER DEREN VERWENDUNG
Title (fr)
COMPOSITION DE REVETEMENT POUR CONDUCTEURS METALLIQUES ET PROCEDE DE REVETEMENT A L'AIDE DE LADITE COMPOSITION
Publication
Application
Priority
- DE 19909954 A 19990306
- EP 0001720 W 20000301
Abstract (en)
[origin: US6908692B1] An electrically conductive wire coated with a curable coating composition that forms a cured coating having a high partial discharge resitance and good mechanical properties. A process for coating an electrically conductive wire with a curable coating composition and curing the coating composition to form a coating having high partial discharge resistance and good mechanical properties.
IPC 1-7
IPC 8 full level
C09D 185/00 (2006.01); C09D 5/24 (2006.01); C09D 179/08 (2006.01); H01B 3/00 (2006.01); H01B 3/30 (2006.01); H01B 3/36 (2006.01); H01B 3/38 (2006.01); H01B 3/42 (2006.01); H01B 3/44 (2006.01)
CPC (source: EP KR US)
H01B 3/30 (2013.01 - KR); H01B 3/308 (2013.01 - EP US); Y10T 428/12597 (2015.01 - EP US); Y10T 428/12611 (2015.01 - EP US); Y10T 428/12618 (2015.01 - EP US); Y10T 428/1266 (2015.01 - EP US); Y10T 428/12667 (2015.01 - EP US); Y10T 428/12674 (2015.01 - EP US)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 0054286 A1 20000914; AT E252270 T1 20031115; AU 3656800 A 20000928; AU 763369 B2 20030717; BR 0008834 A 20020423; BR 0008834 B1 20100406; CA 2362157 A1 20000914; CA 2362157 C 20080506; CN 1192397 C 20050309; CN 1343363 A 20020403; DE 19909954 A1 20000928; DE 50004076 D1 20031120; EP 1166283 A1 20020102; EP 1166283 B1 20031015; JP 2002539288 A 20021119; JP 4384362 B2 20091216; KR 100472738 B1 20050308; KR 20010110654 A 20011213; MX PA01009033 A 20020918; PL 200701 B1 20090130; PL 350766 A1 20030127; TR 200102579 T2 20020621; US 6908692 B1 20050621
DOCDB simple family (application)
EP 0001720 W 20000301; AT 00915160 T 20000301; AU 3656800 A 20000301; BR 0008834 A 20000301; CA 2362157 A 20000301; CN 00804665 A 20000301; DE 19909954 A 19990306; DE 50004076 T 20000301; EP 00915160 A 20000301; JP 2000604423 A 20000301; KR 20017011345 A 20010906; MX PA01009033 A 20000301; PL 35076600 A 20000301; TR 200102579 T 20000301; US 91399901 A 20010820