EP 1166331 A1 20020102 - METHOD FOR CONNECTING A CURRENT SUPPLY WIRE WITH A CONTACT PATCH OF AN ELECTRICAL LAMP
Title (en)
METHOD FOR CONNECTING A CURRENT SUPPLY WIRE WITH A CONTACT PATCH OF AN ELECTRICAL LAMP
Title (de)
VERFAHREN ZUM VERBINDEN EINES STROMZUFÜHRUNGSDRAHTES MIT EINEM KONTAKTBLECH EINER ELEKTRISCHEN LAMPE
Title (fr)
PROCEDE DESTINE A RELIER UN FIL D'ALIMENTATION DE COURANT A UNE PLAQUE DE CONTACT D'UNE LAMPE ELECTRIQUE
Publication
Application
Priority
- DE 0100249 W 20010122
- DE 10003434 A 20000127
Abstract (en)
[origin: US2003070293A1] The invention relates to a method for connecting a contact plate (2) a lamp cap to the supply conductor wire (4) which is passed through an aperture (2a) in the contact plate (2). With the aid of a wire (5) which serves as filler, the supply conductor wire (4) and the contact plate (2) are soldered together, by generating an arc between the additional wire (5) and the supply conductor wire (4) or the contact plate (2). The solidified molten material of the additional wire (5) closes off the aperture (2a) and produces a reliable soldered join between the supply conductor wire (4) and the contact plate (2). The polarity of the electric voltage used to generate the arc is advantageously such that the additional wire (5) acts as an anode and the contact plate (2) or the supply conductor wire (4) acts as a cathode. The soldering process according to the invention advantageously takes place under an inert-gas atmosphere.
IPC 1-7
IPC 8 full level
H01J 9/36 (2006.01); H01J 5/46 (2006.01); H01J 9/24 (2006.01); H01J 61/36 (2006.01); H01K 1/40 (2006.01); H01K 1/46 (2006.01); H01K 3/16 (2006.01)
CPC (source: EP KR US)
H01J 5/46 (2013.01 - EP US); H01J 9/247 (2013.01 - EP US); H01J 61/36 (2013.01 - EP US); H01K 1/40 (2013.01 - EP US); H01K 1/46 (2013.01 - KR); Y10T 29/49162 (2015.01 - EP US); Y10T 29/49174 (2015.01 - EP US)
Citation (search report)
See references of WO 0156061A1
Designated contracting state (EPC)
BE DE FR GB IT NL
DOCDB simple family (publication)
US 2003070293 A1 20030417; US 6759618 B2 20040706; CA 2368761 A1 20010802; DE 10003434 A1 20010802; DE 50109529 D1 20060524; EP 1166331 A1 20020102; EP 1166331 B1 20060419; HU 226839 B1 20091228; HU P0200885 A2 20020629; JP 2003521097 A 20030708; JP 4767469 B2 20110907; KR 100723074 B1 20070529; KR 20020001794 A 20020109; MX PA01009765 A 20030624; WO 0156061 A1 20010802
DOCDB simple family (application)
US 93750301 A 20010927; CA 2368761 A 20010122; DE 0100249 W 20010122; DE 10003434 A 20000127; DE 50109529 T 20010122; EP 01909509 A 20010122; HU P0200885 A 20010122; JP 2001555118 A 20010122; KR 20017012044 A 20010921; MX PA01009765 A 20010122