Global Patent Index - EP 1167653 B1

EP 1167653 B1 2004-09-08 - Method for laying floor panels

Title (en)

Method for laying floor panels

Title (de)

Verfahren zum Verlegen von Bodenpaneelen

Title (fr)

Procédé de pose de panneaux de sol

Publication

EP 1167653 B1 (DE)

Application

EP 00113843 A

Priority

EP 00113843 A

Abstract (en)

[origin: EP1167653A1] The procedure for laying and mechanical connection of floor panels (P) entails connecting and locking a number of panels by their transverse sides to set out a first row on the floor of a room. A panel is then connected to one or two panels of the first row by the tongue and groove connection on the longitudinal side to begin a second row. The tongue (3) of a second panel is then pushed into the groove (4) on the transverse side of the first panel of the second row from the longitudinal side in the direction of the panels of the first row, and the second panel is then locked to one or two panels of the first row.

IPC 1-7

E04F 15/04

IPC 8 full level

E04F 15/02 (2006.01); E04F 15/04 (2006.01)

CPC

E04F 15/04 (2013.01); E04F 2201/0115 (2013.01); Y10T 428/14 (2013.01); Y10T 428/2395 (2015.04)

DCS

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family

EP 1167653 A1 20020102; EP 1167653 B1 20040908; AT 275682 T 20040915; AU 5409101 A 20020103; AU 778096 B2 20041118; CA 2351299 A1 20011230; CA 2351299 C 20100126; CN 1330196 A 20020109; DE 50007685 D1 20041014; ES 2226662 T3 20050401; JP 2002021306 A 20020123; NO 20013274 D0 20010629; NO 20013274 L 20011231; NO 321637 B1 20060612; PL 198638 B1 20080731; PL 348016 A1 20020102; PT 1167653 E 20050131; RU 2266380 C2 20051220; TR 200101683 A2 20020121; TR 200101683 A3 20020121; US 2002046542 A1 20020425; US 6711869 B2 20040330