Global Patent Index - EP 1167956 A1

EP 1167956 A1 20020102 - INSPECTION METHOD FOR SEALED PACKAGE

Title (en)

INSPECTION METHOD FOR SEALED PACKAGE

Title (de)

PRÜFVERFAHREN FÜR GESIEGELTE VERPACKUNGEN

Title (fr)

PROCEDE D'EXAMEN D'EMBALLAGES ETANCHES

Publication

EP 1167956 A1 20020102 (EN)

Application

EP 00904079 A 20000221

Priority

  • JP 0000985 W 20000221
  • JP 6281099 A 19990310

Abstract (en)

The invention provides an efficient inspection method for inspecting a hermetically sealed package for pinholes, in which when a hermetically sealed package in which contents such as electrically conductive fluid or food are covered with an electrically insulating film is inspected for pinholes by using a high voltage, the inspection can be achieved with an extremely simple procedure while fully preventing occurrence of misoperations due to the atmosphere such as humidity during the inspection. In a hermetically sealed package in which contents 1 such as electrically conductive fluid are covered with an electrically insulating film 2, an electrical conductor 4 derived from a voltage output terminal of a DC high voltage power supply 6 is put into contact with or proximity to a side face portion 31 of the hermetically sealed package, by which the contents 1 in the hermetically sealed package 3 are electrified. Next, a lead wire 8 is connected to a connecting terminal 5a of an electrode 5 put into close contact with or opposed proximity to an inspection-object portion 3a of the package 3 where pinholes are most likely to occur, and the lead wire 8 is grounded. Then, a discharge current derived from the inspection-object portion 3a that flows only when a pinhole is present is detected by a discharge current detector 7, by which the presence or absence of a pinhole is detected depending on the presence or absence of the discharge current. In this procedure, the inspection can be made by placing the package on a support electrode derived from an AC high voltage power-supply-and electrifying the contents. <IMAGE>

IPC 1-7

G01N 27/24; G01N 27/92; G01M 3/40

IPC 8 full level

B65B 57/00 (2006.01); G01M 3/40 (2006.01); G01N 27/20 (2006.01); G01N 27/92 (2006.01)

CPC (source: EP KR US)

G01M 3/40 (2013.01 - EP KR US); G01N 27/205 (2013.01 - EP US); G01N 33/42 (2013.01 - KR)

Citation (search report)

See references of WO 0054038A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

EP 1167956 A1 20020102; AU 2576200 A 20000928; CA 2365706 A1 20000914; CN 1206522 C 20050615; CN 1350639 A 20020522; JP 2000258399 A 20000922; JP 3494585 B2 20040209; KR 20010103031 A 20011117; TW 436449 B 20010528; US 6593752 B1 20030715; WO 0054038 A1 20000914

DOCDB simple family (application)

EP 00904079 A 20000221; AU 2576200 A 20000221; CA 2365706 A 20000221; CN 00807370 A 20000221; JP 0000985 W 20000221; JP 6281099 A 19990310; KR 20017010944 A 20010825; TW 89103080 A 20000222; US 93625201 A 20010907