Global Patent Index - EP 1177076 A1

EP 1177076 A1 20020206 - APPARATUS AND METHOD FOR CUTTING OBJECTS

Title (en)

APPARATUS AND METHOD FOR CUTTING OBJECTS

Title (de)

VERFAHREN SOWIE VORRICHTUNG ZUM SCHNEIDEN VON GEGENSTÄNDEN

Title (fr)

APPAREIL ET PROCEDE POUR DECOUPER DES OBJETS

Publication

EP 1177076 A1 20020206 (EN)

Application

EP 99940455 A 19990902

Priority

  • IS 9900009 W 19990902
  • IS 4841 A 19980902

Abstract (en)

[origin: WO0013864A1] The invention concerns apparatus and method for automatic cutting of objects into portions of reduced dimension. More specifically the invention concerns a cutting device (4) placed between two spaced-apart conveyors (2, 3). The cutting device is further operatively connected to a computer (6) and moveable in a space (9) between the conveyors. The characteristics of the object to be cut are determined. By utilising at least one of the characteristics to establishing the desired cutting pattern one is able to cut the object by band saw cutting blade (7). The cutting blade extending through the conveying path of the object and transversely moveable with respect to said conveying path of the object.

IPC 1-7

B26D 7/30; A22C 25/18

IPC 8 full level

A22C 17/00 (2006.01); A22C 25/18 (2006.01); B23D 53/00 (2006.01); B23D 55/04 (2006.01); B23D 59/00 (2006.01); B26D 5/34 (2006.01); B26D 7/30 (2006.01); B26D 5/00 (2006.01)

CPC (source: EP)

A22C 17/0086 (2013.01); A22C 25/18 (2013.01); B23D 53/00 (2013.01); B23D 55/046 (2013.01); B23D 59/002 (2013.01); B26D 7/30 (2013.01); B26D 5/00 (2013.01)

Citation (search report)

See references of WO 0013864A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

WO 0013864 A1 20000316; AU 5442799 A 20000327; EP 1177076 A1 20020206; IS 5874 A 20010302

DOCDB simple family (application)

IS 9900009 W 19990902; AU 5442799 A 19990902; EP 99940455 A 19990902; IS 5874 A 20010302