EP 1177478 A1 20020206 - PHOTOSENSITIVE COMPOSITION
Title (en)
PHOTOSENSITIVE COMPOSITION
Title (de)
LICHTEMPFINDLICHE ZUSAMMENSETZUNG
Title (fr)
COMPOSITION PHOTOSENSIBLE
Publication
Application
Priority
- CH 89999 A 19990511
- EP 0004009 W 20000504
Abstract (en)
[origin: WO0068739A1] A photosensitive polymerisable composition, which comprises at least one cyclic and/or oligomeric compound composed of structural units of formula (I), wherein R is identical or different radicals of formula -(A)-O-C(O)-C(R1)=CH2, and R1 is hydrogen or methyl, A is a transition group, and n is an integer from 3 to 18, preferably 3 or 4 and, most preferably, 3, and the use of this composition as photostructurable solder stopping resist for the production of solder masks for printed circuit boards.
IPC 1-7
IPC 8 full level
C08F 290/00 (2006.01); C08G 79/04 (2006.01); G03F 7/027 (2006.01); H05K 3/28 (2006.01)
CPC (source: EP KR)
C08F 2/48 (2013.01 - KR); C08F 2/50 (2013.01 - KR); G03F 7/027 (2013.01 - EP KR); G03F 7/029 (2013.01 - KR); G03F 7/031 (2013.01 - KR); G03F 7/033 (2013.01 - KR); H05K 3/287 (2013.01 - EP)
Citation (search report)
See references of WO 0068739A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 0068739 A1 20001116; AU 4916800 A 20001121; CA 2369025 A1 20001116; CN 1350660 A 20020522; EP 1177478 A1 20020206; HK 1044048 A1 20021004; JP 2002544542 A 20021224; KR 20020006698 A 20020124
DOCDB simple family (application)
EP 0004009 W 20000504; AU 4916800 A 20000504; CA 2369025 A 20000504; CN 00807369 A 20000504; EP 00931115 A 20000504; HK 02105574 A 20020729; JP 2000616465 A 20000504; KR 20017012695 A 20011005