EP 1179845 A2 20020213 - Semiconductor device and manufacturing method thereof
Title (en)
Semiconductor device and manufacturing method thereof
Title (de)
Halbleiterbauelement und dessen Herstellungsverfahren
Title (fr)
Dispositif semiconducteur et procédé de fabrication
Publication
Application
Priority
JP 2000242207 A 20000810
Abstract (en)
In the present invention, a semiconductor device is provided having a semiconductor chip mounted on a chip mounting part of a lead frame, a resin receiver provided on the side of the rear surface of the chip mounting part, primary sealing resin that seals the semiconductor chip in a range in which the resin receiver is provided so that space is formed between the semiconductor chip and the resin receiver and secondary sealing resin that wraps the primary sealing resin together with the resin receiver and forms double sealed structure. <IMAGE>
IPC 1-7
IPC 8 full level
H01L 23/29 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/50 (2006.01)
CPC (source: EP US)
H01L 21/56 (2013.01 - EP US); H01L 23/3135 (2013.01 - EP US); H01L 23/315 (2013.01 - EP US); H01L 23/49558 (2013.01 - EP US); H01L 2224/16 (2013.01 - EP US); H01L 2224/16245 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US)
Designated contracting state (EPC)
DE GB
DOCDB simple family (publication)
EP 1179845 A2 20020213; EP 1179845 A3 20041103; JP 2002057253 A 20020222; TW 499744 B 20020821; US 2002020923 A1 20020221
DOCDB simple family (application)
EP 01119051 A 20010807; JP 2000242207 A 20000810; TW 90119593 A 20010809; US 92272101 A 20010807