Global Patent Index - EP 1180763 A3

EP 1180763 A3 20030312 - Ceramic sound absorbing material and manufacturing method therefor

Title (en)

Ceramic sound absorbing material and manufacturing method therefor

Title (de)

Keramisches, schalldämmendes Material und dessen Herstellungsverfahren

Title (fr)

Matériau céramique, acoustiquement absorbant et son procédé de fabrication

Publication

EP 1180763 A3 20030312 (EN)

Application

EP 01110763 A 20010503

Priority

  • JP 2000246111 A 20000815
  • JP 2000251880 A 20000823

Abstract (en)

[origin: EP1180763A2] An object of the present invention is to reuse wastes of used or defective sound absorbing material body as a raw material for sound absorbing material body. As aggregates for the sound absorbing material of the present invention, ground mullite particles with an average particle size of about 0.5 to 1 mm are used. As a binder, polyethylene terephthalate (hereinafter referred to as PET) resin, which is a thermoplastic resin, of a form of pellet not larger than 1 mm is used. The aggregates are heated to a temperature in the range of 245 DEG C to 290 DEG C, which is the melting point of PET resin. In order to ensure the smoothness of surface layer when a mixture is poured into a mold, pressing with a pressure of 40 to 1000 kgf/cm<2> is performed. After pressing, the product is cooled and solidified, and then is removed from the mold, whereby a sound absorbing board with a thickness of 8 mm is obtained. <IMAGE>

IPC 1-7

G10K 11/162

IPC 8 full level

G10K 11/165 (2006.01)

CPC (source: EP)

G10K 11/165 (2013.01)

Citation (search report)

  • [A] US 5536910 A 19960716 - HARROLD RONALD T [US], et al
  • [A] US 5820975 A 19981013 - ODA KATSUTOSHI [JP], et al
  • [A] PATENT ABSTRACTS OF JAPAN vol. 1997, no. 05 30 May 1997 (1997-05-30)
  • [A] PATENT ABSTRACTS OF JAPAN vol. 016, no. 552 (C - 1006) 20 November 1992 (1992-11-20)
  • [A] PATENT ABSTRACTS OF JAPAN vol. 014, no. 171 (C - 0706) 3 April 1990 (1990-04-03)
  • [A] PATENT ABSTRACTS OF JAPAN vol. 2000, no. 10 17 November 2000 (2000-11-17)
  • [A] PATENT ABSTRACTS OF JAPAN vol. 013, no. 595 (C - 672) 27 December 1989 (1989-12-27)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

EP 1180763 A2 20020220; EP 1180763 A3 20030312; TW I248427 B 20060201

DOCDB simple family (application)

EP 01110763 A 20010503; TW 90111069 A 20010509