EP 1183604 A2 20020306 - TEST INTERFACE FOR ELECTRONIC CIRCUIRTS
Title (en)
TEST INTERFACE FOR ELECTRONIC CIRCUIRTS
Title (de)
TEST-SCHNITTSTELLE FÜR ELEKTRONISCHE SCHALTUNGEN
Title (fr)
INTERFACE MASSIVEMENT PARALLELE DESTINEE AUX CIRCUITS ELECTRONIQUES
Publication
Application
Priority
- US 0014768 W 20000526
- US 13663799 P 19990527
Abstract (en)
[origin: WO0073905A2] Several embodiments of massively parallel interface structures are disclosed, which may be used in a wide variety of permanent or temporary applications, such as for interconnecting integrated circuits (ICs) to test and burn-in equipment, for interconnecting modules within electronic devices, for interconnecting computers and other peripheral devices within a network, or for interconnecting other electronic circuitry. Preferred embodiments of the massively parallel interface structures provide massively parallel integrated circuit test assemblies. The massively parallel interface structures preferably use one or more substrates to establish connections between one or more integrated circuits on a semiconductor wafer, and one or more test modules. One or more layers on the intermediate substrates preferably include MEMS and/or thin-film fabricated spring probes. The parallel interface assemblies provide tight signal pad pitch and compliance, and preferably enable the parallel testing or burn-in of multiple ICs, using commercial wafer probing equipment. In some preferred embodiments, the parallel interface assembly structures include separable standard electrical connector components, which reduces assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form.
IPC 1-7
IPC 8 full level
G01R 1/06 (2006.01); G01R 1/073 (2006.01); G01R 31/26 (2006.01); G01R 31/28 (2006.01); G11C 29/56 (2006.01); H01L 21/66 (2006.01)
CPC (source: EP)
G01R 1/07378 (2013.01); G01R 31/2863 (2013.01)
Citation (search report)
See references of WO 0073905A2
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 0073905 A2 20001207; WO 0073905 A3 20010907; AU 5171800 A 20001218; EP 1183604 A2 20020306; JP 2003501819 A 20030114; KR 20020028159 A 20020416
DOCDB simple family (application)
US 0014768 W 20000526; AU 5171800 A 20000526; EP 00936397 A 20000526; JP 2001500957 A 20000526; KR 20017015187 A 20011127