EP 1183715 A2 20020306 - SYSTEM FOR PROCESSING WAFERS
Title (en)
SYSTEM FOR PROCESSING WAFERS
Title (de)
ANLAGE ZUR BEARBEITUNG VON WAFERN
Title (fr)
SYSTEME DE TRAITEMENT DE TRANCHES
Publication
Application
Priority
- DE 0001452 W 20000505
- DE 19921244 A 19990507
Abstract (en)
[origin: DE19921244A1] The invention relates to a system for processing wafers in at least one clean room (1). The inventive system comprises an arrangement of production units (2) for carrying out individual production steps and a transport system for transporting the wafers between different production units (2). Furthermore, at least one control station (7) is provided for automatically tracking and controlling the material flow of the wafers. Process data is read in the control station (7) by the production units (2) and/or the transport system.
IPC 1-7
IPC 8 full level
G05B 19/418 (2006.01); G07C 3/00 (2006.01); H01L 21/00 (2006.01)
CPC (source: EP)
G05B 19/41825 (2013.01); G07C 3/00 (2013.01); H01L 21/67276 (2013.01); Y02P 90/02 (2015.11)
Citation (search report)
See references of WO 0068974A2
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
DE 19921244 A1 20001116; EP 1183715 A2 20020306; TW 480589 B 20020321; WO 0068974 A2 20001116; WO 0068974 A3 20010405
DOCDB simple family (application)
DE 19921244 A 19990507; DE 0001452 W 20000505; EP 00940171 A 20000505; TW 89108702 A 20001218