EP 1184479 A1 20020306 - Method of forming a reactive-element containing aluminide on a metallic substrate

Title (en)

Method of forming a reactive-element containing aluminide on a metallic substrate

Title (de)

Verfahren zur Herstellung eines Aluminid-Überzugs mit einem reaktiven Element auf einen metallischen Gegenstand

Title (fr)

Formation d'un revêtement aluminiure incorporant un élément réactif sur un substrat métallique

Publication

EP 1184479 A1 20020306 (FR)

Application

EP 01402232 A 20010827

Priority

FR 0011000 A 20000828

Abstract (en)

[origin: US2002023696A1] The reactive element is introduced to the surface of the metal substrate in the form of an oxide powder and the aluminide-type coating is then formed.

Abstract (fr)

L'élément réactif est apporté à la surface du substrat métallique sous forme de poudre d'oxyde et on forme ensuite le revêtement de type aluminiure.

IPC 1-7

C23C 10/02; C23C 10/52

IPC 8 full level

F01D 5/28 (2006.01); C23C 10/02 (2006.01); C23C 10/52 (2006.01); C23C 24/08 (2006.01); F02C 7/00 (2006.01)

CPC (source: EP US)

C23C 10/02 (2013.01 - EP US); C23C 10/52 (2013.01 - EP US); Y10T 428/12528 (2015.01 - EP US)

Citation (search report)

[X] US 5902638 A 19990511 - VAKIL HIMANSHU BACHUBHAI [US]
[X] GB 2285632 A 19950719 - GARRETT CORP [US]
[A] US 3979273 A 19760907 - PANZERA CARLINO, et al
[A] US 6033623 A 20000307 - DEEVI SEETHARAMA C [US], et al
[A] EP 0386386 A1 19900912 - UNITED TECHNOLOGIES CORP [US]
[A] DE 19824792 A1 19991216 - MTU MUENCHEN GMBH [DE]
[A] US 4071638 A 19780131 - CHANG DAVID R, et al
[A] FR 2529911 A1 19840113 - SNECMA [FR]
[AD] US 5824423 A 19981020 - MAXWELL DOUGLAS HUGH [US], et al

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

EP 1184479 A1 20020306; CA 2356305 A1 20020228; CA 2356305 C 20091201; FR 2813318 A1 20020301; FR 2813318 B1 20030425; JP 2002146555 A 20020522; RU 2276699 C2 20060520; UA 76937 C2 20061016; US 2002023696 A1 20020228; US 6673709 B2 20040106

DOCDB simple family (application)

EP 01402232 A 20010827; CA 2356305 A 20010824; FR 0011000 A 20000828; JP 2001256423 A 20010827; RU 2001124268 A 20010824; UA 2001085969 A 20010827; US 93850001 A 20010827