EP 1185143 A1 20020306 - HOT PLATE AND CONDUCTOR PASTE
Title (en)
HOT PLATE AND CONDUCTOR PASTE
Title (de)
HEIZPLATTE UND LEITFÄHIGE PASTE
Title (fr)
PLAQUE CHAUFFANTE ET PÂTE CONDUCTRICE
Publication
Application
Priority
- JP 0002874 W 20000501
- JP 12697399 A 19990507
- JP 32306199 A 19991112
- JP 2000126786 A 20000427
Abstract (en)
A hot plate that does not expand much, has superior adhesion, and is provided with a conductive pattern layer having a large specific resistance. The hot plate 3 uses a ceramic nitride substrate 9, which includes conductive patterns 10, 10a. The conductive pattern layers 10, 10a is formed from ruthenium oxide, bismuth or its oxide, glass frit, and noble metal grains. <IMAGE>
IPC 1-7
IPC 8 full level
H01B 1/22 (2006.01); H01C 7/00 (2006.01); H01L 21/027 (2006.01); H05B 3/10 (2006.01); H05B 3/12 (2006.01); H05B 3/14 (2006.01); H05B 3/16 (2006.01); H05B 3/20 (2006.01); H05B 3/26 (2006.01); H05B 3/74 (2006.01)
CPC (source: EP US)
H05B 3/12 (2013.01 - EP); H05B 3/141 (2013.01 - EP); H05B 3/143 (2013.01 - EP US); H05B 3/265 (2013.01 - EP); H05B 3/74 (2013.01 - EP)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
EP 1185143 A1 20020306; EP 1185143 A4 20050307; EP 1185143 A9 20020515; JP 2001203066 A 20010727; WO 0069218 A1 20001116
DOCDB simple family (application)
EP 00922933 A 20000501; JP 0002874 W 20000501; JP 2000126786 A 20000427