Global Patent Index - EP 1185144 A1

EP 1185144 A1 20020306 - HOT PLATE AND CONDUCTIVE PASTE

Title (en)

HOT PLATE AND CONDUCTIVE PASTE

Title (de)

HEIZPLATTEN UND LEITFÄHIGE PASTE

Title (fr)

PLAQUE CHAUFFANTE ET PATE CONDUCTRICE

Publication

EP 1185144 A1 20020306 (EN)

Application

EP 00922932 A 20000501

Priority

  • JP 0002873 W 20000501
  • JP 12697299 A 19990507
  • JP 2000126785 A 20000427

Abstract (en)

A hot plate having a conductive pattern layer that does not expand much and has superior adhesion. The hot plate (3) has a conductive pattern layer (10, 10a) arranged on a ceramic nitride substrate (9). The conductive pattern layer (10, 10a) includes bismuth or bismuth oxide, glass frit, and noble metal grains. <IMAGE>

IPC 1-7

H05B 3/16; H05B 3/12; H05B 3/14; H05B 3/20; H01B 1/22; H01L 21/027

IPC 8 full level

H01B 1/16 (2006.01); H01B 1/22 (2006.01); H01C 7/00 (2006.01); H01L 21/027 (2006.01); H05B 3/10 (2006.01); H05B 3/12 (2006.01); H05B 3/14 (2006.01); H05B 3/16 (2006.01); H05B 3/20 (2006.01); H05B 3/26 (2006.01); H05B 3/74 (2006.01)

CPC (source: EP US)

H01B 1/16 (2013.01 - EP); H05B 3/12 (2013.01 - EP); H05B 3/143 (2013.01 - EP US); H05B 3/265 (2013.01 - EP); H05B 3/74 (2013.01 - EP)

Citation (search report)

See references of WO 0069220A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

EP 1185144 A1 20020306; JP 2001028290 A 20010130; WO 0069220 A1 20001116

DOCDB simple family (application)

EP 00922932 A 20000501; JP 0002873 W 20000501; JP 2000126785 A 20000427