EP 1185144 A1 20020306 - HOT PLATE AND CONDUCTIVE PASTE
Title (en)
HOT PLATE AND CONDUCTIVE PASTE
Title (de)
HEIZPLATTEN UND LEITFÄHIGE PASTE
Title (fr)
PLAQUE CHAUFFANTE ET PATE CONDUCTRICE
Publication
Application
Priority
- JP 0002873 W 20000501
- JP 12697299 A 19990507
- JP 2000126785 A 20000427
Abstract (en)
A hot plate having a conductive pattern layer that does not expand much and has superior adhesion. The hot plate (3) has a conductive pattern layer (10, 10a) arranged on a ceramic nitride substrate (9). The conductive pattern layer (10, 10a) includes bismuth or bismuth oxide, glass frit, and noble metal grains. <IMAGE>
IPC 1-7
H05B 3/16; H05B 3/12; H05B 3/14; H05B 3/20; H01B 1/22; H01L 21/027
IPC 8 full level
H01B 1/16 (2006.01); H01B 1/22 (2006.01); H01C 7/00 (2006.01); H01L 21/027 (2006.01); H05B 3/10 (2006.01); H05B 3/12 (2006.01); H05B 3/14 (2006.01); H05B 3/16 (2006.01); H05B 3/20 (2006.01); H05B 3/26 (2006.01); H05B 3/74 (2006.01)
CPC (source: EP US)
H01B 1/16 (2013.01 - EP); H05B 3/12 (2013.01 - EP); H05B 3/143 (2013.01 - EP US); H05B 3/265 (2013.01 - EP); H05B 3/74 (2013.01 - EP)
Citation (search report)
See references of WO 0069220A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
EP 1185144 A1 20020306; JP 2001028290 A 20010130; WO 0069220 A1 20001116
DOCDB simple family (application)
EP 00922932 A 20000501; JP 0002873 W 20000501; JP 2000126785 A 20000427