Global Patent Index - EP 1186035 A1

EP 1186035 A1 20020313 - ELECTRONIC COMPONENT WITH FLEXIBLE CONTACT STRUCTURES AND METHOD FOR THE PRODUCTION OF SAID COMPONENT

Title (en)

ELECTRONIC COMPONENT WITH FLEXIBLE CONTACT STRUCTURES AND METHOD FOR THE PRODUCTION OF SAID COMPONENT

Title (de)

ELEKTRONISCHES BAUELEMENT MIT FLEXIBLEN KONTAKTIERUNGSSTELLEN UND VERFAHREN ZUM HERSTELLEN EINES DERARTIGEN BAUELEMENTS

Title (fr)

COMPOSANT ELECTRONIQUE A STRUCTURES DE CONTACT SOUPLES ET PROCEDE DE FABRICATION D'UN TEL COMPOSANT

Publication

EP 1186035 A1 20020313 (DE)

Application

EP 00934894 A 20000411

Priority

  • DE 0001123 W 20000411
  • DE 19927750 A 19990617

Abstract (en)

[origin: WO0079589A1] Disclosed is an electronic component with an electronic circuit and electronic contacts which are disposed at least on the first surface (2) of the electronic component to enable contacting of said electronic circuit. At least one flexible elevation (3) made of an insulating material is arranged on the first surface (2) and at least one electrical contact (1) is arranged on the at least one flexible elevation (3). A line path (8) is disposed on the surface of or inside the flexible elevation (3) between the at least one electrical contact (1) and the electronic circuit.

IPC 1-7

H01L 23/485

IPC 8 full level

H01L 23/12 (2006.01); H01L 21/60 (2006.01); H01L 23/485 (2006.01)

CPC (source: EP KR US)

H01L 24/10 (2013.01 - EP US); H01L 24/13 (2013.01 - EP KR US); H01L 2224/0231 (2013.01 - EP US); H01L 2224/0401 (2013.01 - EP US); H01L 2224/13 (2013.01 - EP KR US); H01L 2224/13099 (2013.01 - EP US); H01L 2924/00013 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01019 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01046 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/351 (2013.01 - EP US)

C-Set (source: EP US)

  1. H01L 2924/00013 + H01L 2224/29099
  2. H01L 2924/351 + H01L 2924/00
  3. H01L 2224/13 + H01L 2924/00
  4. H01L 2924/12042 + H01L 2924/00

Citation (search report)

See references of WO 0079589A1

Designated contracting state (EPC)

DE FR GB IT

DOCDB simple family (publication)

WO 0079589 A1 20001228; EP 1186035 A1 20020313; JP 2003502866 A 20030121; JP 2006108705 A 20060420; JP 4226589 B2 20090218; KR 20020011440 A 20020208; US 2002089058 A1 20020711; US 2005208703 A1 20050922; US 6956287 B2 20051018; US 7820482 B2 20101026

DOCDB simple family (application)

DE 0001123 W 20000411; EP 00934894 A 20000411; JP 2001505058 A 20000411; JP 2005339301 A 20051124; KR 20017016160 A 20011215; US 12451505 A 20050506; US 2222601 A 20011217