EP 1186060 A1 20020313 - CURRENT-CARRYING CONNECTING ELEMENTS FOR PLATE CONDUCTORS CONSISTING OF HIGH-TEMPERATURE SUPRACONDUCTIVE THIN LAYERS
Title (en)
CURRENT-CARRYING CONNECTING ELEMENTS FOR PLATE CONDUCTORS CONSISTING OF HIGH-TEMPERATURE SUPRACONDUCTIVE THIN LAYERS
Title (de)
STROMTRAGENDE VERBINDUNGSELEMENTE FÜR PLATTENLEITER AUS HOCHTEMPERATUR-SUPRALEITENDEN DÜNNSCHICHTEN
Title (fr)
ELEMENTS DE LIAISON PORTEURS DE COURANT ET DESTINES A DES PLAQUES CONDUCTRICES REALISEES EN MINCES COUCHES SUPRACONDUCTRICES HAUTE TEMPERATURE
Publication
Application
Priority
- DE 0001909 W 20000614
- DE 19928324 A 19990616
Abstract (en)
[origin: DE19928324A1] The invention relates to current-carrying connecting elements for plate conductors consisting of high-temperature supraconductive thin layers, especially for resistive current-limiting devices in switchgear assemblies used for supplying and distributing energy. At least two plate conductors that are situated one behind the other are electroconductively connected by the current-carrying connecting elements and are provided with electrical contact surfaces for receiving current supply lines. The current-carrying connecting elements consist of high-temperature supraconductive strips (HTSL-BD) which are electroconductively connected to the high temperature supraconductive thin layers (HTSL-DS) by material and/or nonpositive fit conducting connections (LV). The approximately arch-shaped cross-sectional contour of the high temperature supraconductive strips (HTSL-BD) is adapted to the distance between the high-temperature supraconductive thin layers (HTSL-DS) to be connected. The current-carrying connecting elements and the plate conductors are constituent parts of resistive current-limiting devices in switchgear assemblies used for supplying and distributing energy.
IPC 1-7
IPC 8 full level
H01L 39/02 (2006.01); H01L 39/16 (2006.01); H01R 4/68 (2006.01)
CPC (source: EP)
H01R 4/68 (2013.01); H10N 60/30 (2023.02)
Citation (search report)
See references of WO 0077864A1
Designated contracting state (EPC)
CH DE FR GB IT LI
DOCDB simple family (publication)
DE 19928324 A1 20001221; CA 2376976 A1 20001221; EP 1186060 A1 20020313; JP 2003502848 A 20030121; WO 0077864 A1 20001221
DOCDB simple family (application)
DE 19928324 A 19990616; CA 2376976 A 20000614; DE 0001909 W 20000614; EP 00951214 A 20000614; JP 2001504021 A 20000614