Global Patent Index - EP 1188778 A1

EP 1188778 A1 20020320 - Thermosetting resin composition, and resin coated metal foil, prepreg and film-shaped adhesive all using the composition

Title (en)

Thermosetting resin composition, and resin coated metal foil, prepreg and film-shaped adhesive all using the composition

Title (de)

Wärmehärtbare Harzzusammensetzung und harzbeschichtete Metallfolie, Prepreg und folienförmiger Klebstoff diese Zusammensetzung benutzend

Title (fr)

Composition de résine thermodurcissable et feuille métallique revêtu par résine, prepreg et adhésif en forme de feuille tous utilisant ce composition

Publication

EP 1188778 A1 20020320 (EN)

Application

EP 01122219 A 20010917

Priority

JP 2000281806 A 20000918

Abstract (en)

A thermosetting resin composition comprising: a polycarbodiimide obtained from organic polyisocyanates containing at least one kind of aromatic polyisocyanate, an epoxy resin, a curing agent for epoxy resin, and a rubber component, wherein the proportions of the individual components are 100 parts by weight of the polycarbodiimide, 30 to 150 parts by weight of the epoxy resin, 1.0 equivalent or less, relative to the epoxy resin, of the curing agent for epoxy resin, and 0.1 to 20 parts by weight of the rubber component which is, in a semi-cured state (a B-stage), free from resin cracking or powder detaching when bent and therefore easy to handle and, after curing, has good electrical properties and heat resistance.

IPC 1-7

C08G 18/02; C08L 79/04; C08J 5/24

IPC 8 full level

C08J 5/24 (2006.01); C08G 18/02 (2006.01); C08G 59/40 (2006.01); C08K 5/00 (2006.01); C08L 21/00 (2006.01); C08L 63/00 (2006.01); C08L 79/00 (2006.01); C08L 79/08 (2006.01); C09J 7/28 (2018.01); C09J 163/00 (2006.01); C09J 179/00 (2006.01); C09K 3/10 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01)

CPC (source: EP US)

C08G 18/025 (2013.01 - EP US); C08L 79/00 (2013.01 - EP US); C09J 7/22 (2017.12 - EP US); C09J 7/28 (2017.12 - EP US); C09J 7/35 (2017.12 - EP US); C09J 2463/00 (2013.01 - EP US); C09J 2479/08 (2013.01 - EP US); H05K 1/0326 (2013.01 - EP US); H05K 3/4626 (2013.01 - EP US); Y10T 428/249994 (2015.04 - EP US); Y10T 428/2896 (2015.01 - EP US); Y10T 428/31511 (2015.04 - EP US); Y10T 428/31515 (2015.04 - EP US); Y10T 428/31529 (2015.04 - EP US); Y10T 428/31721 (2015.04 - EP US)

C-Set (source: EP US)

  1. C08L 79/00 + C08L 63/00
  2. C08L 79/00 + C08L 2666/02
  3. C08L 79/00 + C08L 2666/04

Citation (search report)

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

EP 1188778 A1 20020320; EP 1188778 B1 20050330; DE 60109696 D1 20050504; DE 60109696 T2 20050825; JP 2002088221 A 20020327; JP 3588317 B2 20041110; US 2002081434 A1 20020627; US 6524711 B2 20030225

DOCDB simple family (application)

EP 01122219 A 20010917; DE 60109696 T 20010917; JP 2000281806 A 20000918; US 95319001 A 20010917