EP 1190448 A1 20020327 - CHIP PACKAGE WITH MOLDED UNDERFILL
Title (en)
CHIP PACKAGE WITH MOLDED UNDERFILL
Title (de)
CHIP-GEHÄUSE MIT SPRITZGEGOSSENER UNTERFÜLLUNG
Title (fr)
BOITIER DE MICROCIRCUIT A COMBLEMENT MOULE
Publication
Application
Priority
US 9910771 W 19990514
IPC 1-7
IPC 8 full level
H01L 21/56 (2006.01); H01L 21/60 (2006.01); H01L 23/28 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01)
CPC (source: EP KR)
H01L 23/16 (2013.01 - KR); H01L 2224/32225 (2013.01 - EP); H01L 2924/14 (2013.01 - EP); H01L 2924/15151 (2013.01 - EP); H01L 2924/15311 (2013.01 - EP)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
EP 1190448 A1 20020327; EP 1190448 A4 20041124; JP 2003500833 A 20030107; KR 20020035477 A 20020511
DOCDB simple family (application)
EP 99923109 A 19990514; JP 2000619029 A 19990514; KR 20017014402 A 20011112