EP 1190455 A2 20020327 - DUAL CMP PAD CONDITIONER
Title (en)
DUAL CMP PAD CONDITIONER
Title (de)
DOPPEL-ABRICHTVORRICHTUNG FÜR POLIERKISSEN
Title (fr)
DOUBLE DISPOSITIF DE CONDITIONNEMENT POUR TAMPONS DE POLISSAGE CHIMIQUE ET MECANIQUE
Publication
Application
Priority
- US 0008340 W 20000329
- US 28371699 A 19990401
Abstract (en)
[origin: WO0060645A2] According to an example embodiment, the present invention is directed to a CMP polishing apparatus having at least two conditioning arms for use in conditioning a polishing pad. The CMP polishing apparatus includes a first pad conditioner configured and arranged both to dispense slurry and to condition the pad. A second pad conditioner is configured and arranged both to clean a portion of the polishing pad and to dispense cleaning chemicals. Benefits of using this embodiment include enhanced pad cleaning, better slurry dispense, improved wafer quality, and faster production.
[origin: WO0060645A2] According to an example embodiment, the present invention is directed to a CMP polishing apparatus (100) having at least two conditioning arms (110+120) for use in conditioning a polishing pad (150). The CMP polishing apparatus includes a first pad conditioner (130) configured and arranged both to dispense slurry and to condition the pad. A second pad conditioner (140) is configured and arranged both to clean a portion of the polishing pad (150) and to dispense cleaning chemicals. Benefits of using this embodiment include enhanced pad cleaning, better slurry dispense, improved wafer quality, and faster production.
IPC 1-7
IPC 8 full level
B24B 53/007 (2006.01); B24B 53/013 (2006.01); B24B 53/017 (2012.01); B24B 53/02 (2012.01); B24B 53/12 (2006.01); B24B 57/02 (2006.01); H01L 21/304 (2006.01)
CPC (source: EP KR)
B24B 53/013 (2013.01 - EP); B24B 53/017 (2013.01 - EP); B24B 53/02 (2013.01 - EP); B24B 57/02 (2013.01 - EP); H01L 21/304 (2013.01 - KR)
Citation (search report)
See references of WO 0060645A2
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
WO 0060645 A2 20001012; WO 0060645 A3 20020117; AU 4044400 A 20001023; CN 1362907 A 20020807; EP 1190455 A2 20020327; JP 2002540972 A 20021203; KR 20010071353 A 20010728
DOCDB simple family (application)
US 0008340 W 20000329; AU 4044400 A 20000329; CN 00800898 A 20000329; EP 00919823 A 20000329; JP 2000610047 A 20000329; KR 20007013508 A 20001130