EP 1192656 A1 20020403 - METHOD OF PROTECTING AN UNDERLYING WIRING LAYER DURING DUAL DAMASCENE PROCESSING
Title (en)
METHOD OF PROTECTING AN UNDERLYING WIRING LAYER DURING DUAL DAMASCENE PROCESSING
Title (de)
VERFAHREN ZUM SCHUTZ EINER UNTEREN KONTAKTSCHICHT WÄHREND DER HERSTELLUNG EINER DOPPELDAMASZEN-STRUKTUR
Title (fr)
PROCEDE PERMETTANT DE PROTEGER UNE COUCHE DE CABLAGE SOUS-JACENTE LORS D'UN PROCEDE DE DOUBLE DAMASQUINAGE
Publication
Application
Priority
- US 0040108 W 20000605
- US 34558699 A 19990630
Abstract (en)
[origin: WO0101480A1] A method of forming an interconnection including the steps of forming a sacrificial material (160) that comprises a physical property that is generally insensitive to a photoreaction in a via (150) through a dielectric material (130) to a masking material (120) over a conductive material (110). The method also includes forming a trench (180) over in the dielectric material over the via (150) and removing the sacrificial material (160) from the via.
IPC 1-7
IPC 8 full level
H01L 21/3205 (2006.01); H01L 21/768 (2006.01); H01L 23/52 (2006.01)
CPC (source: EP KR)
H01L 21/768 (2013.01 - KR); H01L 21/76808 (2013.01 - EP); H01L 21/76834 (2013.01 - EP)
Citation (search report)
See references of WO 0101480A1
Designated contracting state (EPC)
DE GB IE
DOCDB simple family (publication)
WO 0101480 A1 20010104; AU 5790800 A 20010131; EP 1192656 A1 20020403; HK 1042380 A1 20020809; IL 147301 A0 20020814; IL 147301 A 20060705; JP 2003528442 A 20030924; JP 4675534 B2 20110427; KR 100452418 B1 20041012; KR 20020020921 A 20020316; TW 531789 B 20030511
DOCDB simple family (application)
US 0040108 W 20000605; AU 5790800 A 20000605; EP 00943434 A 20000605; HK 02104146 A 20020531; IL 14730100 A 20000605; IL 14730101 A 20011225; JP 2001506606 A 20000605; KR 20017016608 A 20011224; TW 89112999 A 20000819