EP 1192844 A1 20020403 - ARRANGEMENT FOR DISSIPATING THERMAL ENERGY GENERATED BY HEAT SOURCE
Title (en)
ARRANGEMENT FOR DISSIPATING THERMAL ENERGY GENERATED BY HEAT SOURCE
Title (de)
VORRICHTUNG ZUR ABFUHR VON WÄRE,DIE VON EINER WÄRMEQUELLE ERZEUGT WIRD
Title (fr)
DISPOSITIF DISSIPATEUR DE L'ENERGIE THERMIQUE PRODUITE PAR UNE SOURCE THERMIQUE
Publication
Application
Priority
- FI 0000597 W 20000629
- FI 991510 A 19990701
Abstract (en)
[origin: WO0103485A1] The invention relates to an arrangement for dissipating thermal energy generated by a heat source (1), which arrangement comprises a heat conductor element (2) for conducting thermal energy generated by the heat source (1) away from the heat source (1), the heat conductor element (2) having at least one micro heat pipe module (3) attached to it for distributing thermal energy generated by the heat source (1) in the heat conductor element (2). The heat source (1) is attached to an element (4) which is made of a heat conducting material and which is in thermal contact with the heat conductor element (2) and which is arranged to conduct thermal energy from the heat source (1) to the heat conductor element (2) by means of the heat conducting ability of said heat conducting material.
IPC 1-7
IPC 8 full level
H01L 23/367 (2006.01); H01L 23/427 (2006.01)
CPC (source: EP US)
H01L 23/3675 (2013.01 - EP US); H01L 23/427 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)
Citation (search report)
See references of WO 0103485A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 0103485 A1 20010111; AU 5831000 A 20010122; EP 1192844 A1 20020403; FI 991510 A 20010102; US 2002117292 A1 20020829
DOCDB simple family (application)
FI 0000597 W 20000629; AU 5831000 A 20000629; EP 00944074 A 20000629; FI 991510 A 19990701; US 2665601 A 20011227